C8051F930-GQ Silicon Laboratories Inc, C8051F930-GQ Datasheet - Page 70

IC 8051 MCU 64K FLASH 32-LQFP

C8051F930-GQ

Manufacturer Part Number
C8051F930-GQ
Description
IC 8051 MCU 64K FLASH 32-LQFP
Manufacturer
Silicon Laboratories Inc
Series
C8051F9xxr
Datasheets

Specifications of C8051F930-GQ

Program Memory Type
FLASH
Program Memory Size
64KB (64K x 8)
Package / Case
32-LQFP
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Number Of I /o
24
Ram Size
4.25K x 8
Voltage - Supply (vcc/vdd)
0.9 V ~ 3.6 V
Data Converters
A/D 23x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F9x
Core
8051
Data Bus Width
8 bit
Data Ram Size
4.25 KB
Interface Type
I2C/SMBus/SPI/UART
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
24
Number Of Timers
4
Operating Supply Voltage
0.9 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F930DK
Minimum Operating Temperature
- 40 C
On-chip Adc
23-ch x 10-bit
No. Of I/o's
24
Ram Memory Size
4KB
Cpu Speed
25MHz
No. Of Timers
4
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
336-1478 - PLATFORM PROG TOOLSTCK F920,F930336-1477 - PLATFORM PROG TOOLSTCK F920,F930336-1473 - KIT DEV C8051F920,F921,F930,F931336-1472 - BOARD TARGET/PROTO W/C8051F930
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1466

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
C8051F930-GQ
Manufacturer:
SILICON
Quantity:
3 500
Part Number:
C8051F930-GQ
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
Part Number:
C8051F930-GQR
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
Part Number:
C8051F930-GQR
Manufacturer:
SILICON LABS/芯科
Quantity:
20 000
C8051F93x-C8051F92x
5.2.4. Settling Time Requirements
A minimum amount of tracking time is required before each conversion can be performed, to allow the
sampling capacitor voltage to settle. This tracking time is determined by the AMUX0 resistance, the ADC0
sampling capacitance, any external source resistance, and the accuracy required for the conversion. Note
that in low-power tracking mode, three SAR clocks are used for tracking at the start of every conversion.
For many applications, these three SAR clocks will meet the minimum tracking time requirements, and
higher values for the external source impedance will increase the required tracking time.
Figure 5.4 shows the equivalent ADC0 input circuit. The required ADC0 settling time for a given settling
accuracy (SA) may be approximated by Equation 5.1. When measuring the Temperature Sensor output or
V
ments as well as the mux impedance and sampling capacitor values.
Where:
SA is the settling accuracy, given as a fraction of an LSB (for example, 0.25 to settle within 1/4 LSB)
t is the required settling time in seconds
R
n is the ADC resolution in bits (10).
70
DD
TOTAL
with respect to GND, R
is the sum of the AMUX0 resistance and any external source resistance.
Note: The value of CSAMPLE depends on the PGA Gain. See Table 4.9 for details.
Equation 5.1. ADC0 Settling Time Requirements
Figure 5.4. ADC0 Equivalent Input Circuits
TOTAL
P0.x
t
reduces to R
=
RC
ln
MUX Select
Input
------ -
SA
2
= R
n
MUX
MUX
Rev. 1.1
R
* C
. See Table 4.9 for ADC0 minimum settling time require-
TOTAL
R
MUX
SAMPLE
C
SAMPLE
C
SAMPLE

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