D12332VFC25 Renesas Electronics America, D12332VFC25 Datasheet - Page 872
D12332VFC25
Manufacturer Part Number
D12332VFC25
Description
MCU 3V 0K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet
1.DF2338VFC25V.pdf
(1246 pages)
Specifications of D12332VFC25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412332VFC25
HD6412332VFC25
HD6412332VFC25
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
D12332VFC25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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19.20.9 PROM Mode Transition Time
Commands cannot be accepted during the oscillation stabilization period or the PROM mode setup
period. After the PROM mode setup time, a transition is made to memory read mode.
Table 19.45 Command Wait State Transition Time Specifications
Item
Standby release (oscillation
stabilization time)
PROM mode setup time
V
Rev.4.00 Sep. 07, 2007 Page 840 of 1210
REJ09B0245-0400
Figure 19.55 Oscillation Stabilization Time, PROM Mode Setup Time, and Power Supply
CC
hold time
V
RES
FWE
Note: Except in auto-program mode and auto-erase mode, drive the FWE input pin low.
CC
t
osc1
t
bmv
Symbol
t
t
t
osc1
bmv
dwn
Memory read
mode
Command
wait state
Fall Sequence
Min
30
10
0
Auto-program mode
Auto-erase mode
Max
—
—
—
Command
wait state
Normal/
abnormal end
identification
t
dwn
Unit
ms
ms
ms
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