D13007VX13V Renesas Electronics America, D13007VX13V Datasheet - Page 601
D13007VX13V
Manufacturer Part Number
D13007VX13V
Description
MCU 3V 0K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Specifications of D13007VX13V
Core Processor
H8/300H
Core Size
16-Bit
Speed
13MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
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Item
Input leakage
current
Three-state
leakage
current
Input pull-up
MOS current
Input
capacitance
Current
dissipation*
Analog power
supply current
Reference
current
RAM standby voltage
Notes: 1. Do not open the pin connections of the AV
is not in use.
2
STBY, NMI,
RES,
MD
Port 7
Ports 4, 6,
8 to B,
A
D
RESO
Port 4
NMI
All input pins
except NMI
Normal
operation
Sleep mode
Module
standby mode
Standby mode
During A/D
conversion
During A/D
and D/A
conversion
Idle
During A/D
conversion
During A/D
and D/A
conversion
Idle
19
15
to A
2
to D
to MD
0
8
,
0
Symbol
|I
|I
–I
C
I
AI
AI
V
CC
in
TSI
RAM
in
p
|
CC
CC
*
|
3
Min
⎯
⎯
⎯
⎯
50
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
2.0
CC
Typ
⎯
⎯
⎯
⎯
⎯
⎯
⎯
45
(5.0 V)
35
(5.0 V)
18
(5.0 V)
0.01
⎯
0.6
0.6
0.01
0.5
2.0
0.01
⎯
, V
Rev.5.00 Sep. 12, 2007 Page 571 of 764
REF
and AV
Max
1.0
1.0
1.0
10.0
300
50
15
100
73
51
5.0
20.0
1.5
1.5
5.0
0.8
3.0
5.0
⎯
SS
20. Electrical Characteristics
pins while the A/D converter
Unit Test Conditions
μA
μA
μA
μA
μA
pF
pF
mA
mA
mA
μA
μA
mA
mA
μA
mA
mA
μA
V
REJ09B0396-0500
V
V
V
AV
V
V
V
V
V
f = 1 MHz
T
f = 20 MHz
f = 20 MHz
f = 20 MHz
T
50°C ≤ T
DASTE = 0
DASTE = 0
a
a
in
CC
in
in
CC
in
in
in
= 25°C
≤ 50°C
= 0.5 V to
= 0.5 V to
CC
= 0.5 V to
= 0 V
= 0 V
= 0 V
–0.5 V
–0.5 V
–0.5 V
a
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