MC912D60CCPVE Freescale Semiconductor, MC912D60CCPVE Datasheet - Page 434

• Manufacturer Part Number: MC912D60CCPVE
• Description: IC MCU 16BIT 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HC12r

Specifications of MC912D60CCPVE

• Core Processor: CPU12
• Core Size: 16-Bit
• Speed: 8MHz
• Connectivity: CAN, MI Bus, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 68
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 16x8/10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 112-LQFP
• Processor Series: HC912D
• Core: HC12
• Data Bus Width: 16 bit
• Data Ram Size: 2 KB
• Interface Type: CAN, SCI, SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 86
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Appendix: CGM Practical Aspects
Technical Data
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spectrum. This is especially the case for the power supply pins
close to the E port, when the ECLK and/or the calibration clock are
used.
On the general VDD power supply input, a ‘T’ low pass filter LCL
can be used (e.g. 10µH-47µF-10µH). The ‘T’ is preferable to the
‘Π’ version as the exhibited impedance is more constant with
respect to the VDD current. Like many modular micro controllers,
HC12 devices have a power consumption which not only varies
with clock edges but also with the functioning modes.
Keep high speed clock and bus trace length to a minimum. The
higher the clock speed, the shorter the trace length. If noisy
signals are sent over long tracks, impedance adjustments should
be considered at both ends of the line (generally, simple resistors
suffice).
Bus drivers like the CAN physical interface should be installed
close to their connector, with dedicated filtering on their power
supply.
Mount components as close to the board as possible. Snip excess
lead length as close to the board as possible. Preferably use
Surface Mount Devices (SMDs).
Mount discrete components as close to the chip that uses them as
possible.
Do not cross sensitive signals ON ANY LAYER. If a sensitive
signal must be crossed by another signal, do it as many layers
away as possible and at right angles.
Always keep PCBs clean. Solder flux, oils from fingerprints,
humidity and general dirt can conduct electricity. Sensitive circuits
can easily be disrupted by small amounts of leakage.
Choose PCB coatings with care. Certain epoxies, paints, gelatins,
plastics and waxes can conduct electricity. If the manufacturer
cannot provide the electrical characteristics of the substance, do
not use it.
Appendix: CGM Practical Aspects
MC68HC912D60A — Rev. 3.1
Freescale Semiconductor