MC912D60CCPVE Freescale Semiconductor, MC912D60CCPVE Datasheet - Page 438

IC MCU 16BIT 112-LQFP

MC912D60CCPVE

Manufacturer Part Number
MC912D60CCPVE
Description
IC MCU 16BIT 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HC12r
Datasheet

Specifications of MC912D60CCPVE

Core Processor
CPU12
Core Size
16-Bit
Speed
8MHz
Connectivity
CAN, MI Bus, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
68
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 16x8/10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
112-LQFP
Processor Series
HC912D
Core
HC12
Data Bus Width
16 bit
Data Ram Size
2 KB
Interface Type
CAN, SCI, SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
86
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC912D60CCPVE
Manufacturer:
FREESCAL
Quantity:
203
Part Number:
MC912D60CCPVE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Appendix: Changes from MC68HC912D60
22.2.1.3 Flash Programming Procedure
22.2.1.4 Flash Programming Time
22.2.1.5 Flash External Programming Voltage
22.2.2 EEPROM
22.2.2.1 EEPROM Architecture
22.2.2.2 EEPROM Clock Source and Pre-scaler
Technical Data
438
Programming of the flash is greatly simplified over previous HC12s. The
read / verify / re-pulse programming algorithm is replaced by a much
simpler method.
The most significant change resulting from the new flash technology is
that the bulk erase and program times are now fixed. The erase time is
at least twice as fast while the word programming time is at least 20%
faster.
The new flash does not require an external high voltage supply. All
voltages required for programming and erase are now generated
internally. Pin 97 (112 QFP) or pin 71 (80 QFP) is now a test pin for the
flash arrays. Applying 12V to this pin can damage the device. On early
production devices it is recommended that this pin is not connected
within the application, but it may be connected to VSS or 5.5V max
without issue.
Like the flash, the EEPROM is also made from this new NVM
technology. The architecture and basic programming and erase
operations are unchanged. However, there is a new optional
programming method that allows faster programming of the EEPROM.
The first major difference on the new EEPROM is that it requires a
constant time base source to ensure secure programming and erase
operations. The clock source that is going to drive the clock divider input
is the external clock input, EXTALi. The divide ratio from this source has
Appendix: Changes from MC68HC912D60
MC68HC912D60A — Rev. 3.1
Freescale Semiconductor

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