D12674RVFQ33 Renesas Electronics America, D12674RVFQ33 Datasheet - Page 336
D12674RVFQ33
Manufacturer Part Number
D12674RVFQ33
Description
IC H8S MCU ROMLESS 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Specifications of D12674RVFQ33
Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412674RVFQ33
HD6412674RVFQ33
HD6412674RVFQ33
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Section 4 Basic Timing
4.4
The external address space is accessed with an 8-bit or 16-bit data bus width in a two-state or
three-state bus cycle. Figure 4.5 shows the read timing for two-state and three-state access. Figure
4.6 shows the write timing for two-state and three-state access. In three-state access, wait states
can be inserted. For further details, refer to the relevant microcontroller hardware manual.
Rev. 4.00 Feb 24, 2006 page 320 of 322
REJ09B0139-0400
External Address Space Access Timing
Address bus
AS
RD
HWR, LWR
Data bus
Figure 4.4 Pin States during On-Chip Supporting Module Access
T1
High-impedance state
Unchanged
Bus cycle
High
High
High
T2
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