R5F61622N50FPV Renesas Electronics America, R5F61622N50FPV Datasheet - Page 28
R5F61622N50FPV
Manufacturer Part Number
R5F61622N50FPV
Description
MCU 24KB FLASH 256K ROM 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8SX/1600r
Specifications of R5F61622N50FPV
Core Size
16/32-Bit
Program Memory Size
256KB (256K x 8)
Core Processor
H8SX
Speed
50MHz
Connectivity
EBI/EMI, I²C, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
74
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b, 6x16b, D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
No. Of I/o's
74
Ram Memory Size
24KB
Cpu Speed
50MHz
No. Of Timers
2
Digital Ic Case Style
LQFP
Supply Voltage Range
3V To 3.6V
Embedded Interface Type
I2C, SCI
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
R5F61622N50FPV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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24.8
24.9
24.10 Sleep Instruction Exception Handling .............................................................................. 921
24.11 Bφ Clock Output Control.................................................................................................. 924
24.12 Usage Notes ...................................................................................................................... 925
Section 25 List of Registers............................................................................... 927
25.1
25.2
25.3
Section 26 Electrical Characteristics ................................................................. 973
26.1
26.2
Rev. 2.00 Sep. 16, 2009 Page xxvi of xxviii
Deep Software Standby Mode .......................................................................................... 908
24.8.1
24.8.2
24.8.3
24.8.4
24.8.5
24.8.6
24.8.7
Hardware Standby Mode .................................................................................................. 919
24.9.1
24.9.2
24.9.3
24.9.4
24.12.1 I/O Port Status................................................................................................... 925
24.12.2 Current Consumption during Oscillation Settling Standby Period ................... 925
24.12.3 Module Stop State of DMAC or DTC .............................................................. 925
24.12.4 On-Chip Peripheral Module Interrupts ............................................................. 925
24.12.5 Writing to MSTPCRA, MSTPCRB, and MSTPCRC....................................... 925
24.12.6 Control of Input Buffers by DIRQnE (n = 3 to 0)............................................. 926
24.12.7 Input Buffer Control by DIRQnE (n = 3 to 0) .................................................. 926
24.12.8 Bφ Output State ................................................................................................ 926
Register Addresses (Address Order)................................................................................. 928
Register Bits ..................................................................................................................... 941
Register States in Each Operating Mode .......................................................................... 960
Electrical Characteristics .................................................................................................. 973
26.1.1
26.1.2
26.1.3
26.1.4
26.1.5
26.1.6
Timing Charts ................................................................................................................... 992
Setting Oscillation Settling Time after Exit from
Deep Software Standby Mode .......................................................................... 911
Entry to Deep Software Standby Mode ............................................................ 908
Exit from Deep Software Standby Mode.......................................................... 909
Pin State on Exit from Deep Software Standby Mode...................................... 910
Bφ Operation after Exit from Deep Software Standby Mode ........................... 910
Deep Software Standby Mode Application Example ....................................... 913
Flowchart of Deep Software Standby Mode Operation .................................... 917
Transition to Hardware Standby Mode............................................................. 919
Clearing Hardware Standby Mode.................................................................... 919
Hardware Standby Mode Timing...................................................................... 919
Timing Sequence at Power-On ......................................................................... 920
Absolute Maximum Ratings ............................................................................. 973
DC Characteristics ............................................................................................ 974
AC Characteristics ............................................................................................ 979
A/D Conversion Characteristics ....................................................................... 986
D/A Conversion Characteristics ....................................................................... 986
∆ΣA/D Conversion Characteristics................................................................... 987
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