DF2377RVFQ33 Renesas Electronics America, DF2377RVFQ33 Datasheet - Page 1146
DF2377RVFQ33
Manufacturer Part Number
DF2377RVFQ33
Description
IC H8S MCU FLASH 3V 384K 144LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet
1.YR0K42378FC000BA.pdf
(1208 pages)
Specifications of DF2377RVFQ33
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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Section 26 Electrical Characteristics
Rev.7.00 Mar. 18, 2009 page 1078 of 1136
REJ09B0109-0700
Read
Write
Note:
EDACK2, EDACK3
DACK0, DACK1
φ
A23 to A0
RAS5 to RAS2
UCAS, LCAS
OE, RD
HWR
D15 to D0
UCAS, LCAS
OE, RD
HWR
D15 to D0
AS
WAIT
Tcw :
Tcwp:
DACK and EDACK timing: when DDS = 0 and EDDS = 0
RAS timing: when RAST = 0
Figure 26.15 DRAM Access Timing: Two-State Access, One Wait
Wait cycle inserted by programmable wait function
Wait cycle inserted by pin wait function
Tp
Tr
Tc1
t
WTS
Tcw
t
WTH
t
WTS
Tcwp
t
WTH
Tc2
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