DF2377RVFQ33 Renesas Electronics America, DF2377RVFQ33 Datasheet - Page 275
DF2377RVFQ33
Manufacturer Part Number
DF2377RVFQ33
Description
IC H8S MCU FLASH 3V 384K 144LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet
1.YR0K42378FC000BA.pdf
(1208 pages)
Specifications of DF2377RVFQ33
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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• RAS Up Mode
φ
Address bus
RASn (CSn)
UCAS, LCAS
RD
OE
Data bus
Note: n = 2 to 5
To select RAS up mode, clear the RCDM bit to 0 in DRAMCR. Each time access to DRAM
space is interrupted and another space is accessed, the RAS signal goes high again. Burst
operation is only performed if DRAM space is continuous. Figure 6.33 shows an example of
the timing in RAS up mode.
Figure 6.33 Example of Operation Timing in RAS Up Mode
T
Row address
p
DRAM space read
T
r
(RAST = 0, CAST = 0)
Column address 1 Column address 2
T
c1
T
c2
Rev.7.00 Mar. 18, 2009 page 207 of 1136
T
DRAM space
c1
read
Section 6 Bus Controller (BSC)
T
c2
External address
Normal space
T
1
REJ09B0109-0700
read
T
2
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