HD64F2166VTE33 Renesas Electronics America, HD64F2166VTE33 Datasheet - Page 283
HD64F2166VTE33
Manufacturer Part Number
HD64F2166VTE33
Description
IC H8S MCU FLASH 512K 144-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Specifications of HD64F2166VTE33
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, LPC, SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
106
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HD64F2166VTE33V
Manufacturer:
Renesas
Quantity:
200
Company:
Part Number:
HD64F2166VTE33V
Manufacturer:
ON
Quantity:
75
Part Number:
HD64F2166VTE33V
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
- Current page: 283 of 876
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• PD3/GA20
• PD2/PME
• PD1/LSMI
• PD0/LSCI
FGA20E
PD3DDR
Pin Function
PMEE
PD2DDR
Pin Function
LSMIE
PD1DDR
Pin Function
LSCIE
PD0DDR
Pin Function
The pin function is switched as shown below according to the combination of the FGA20E bit
of LPC HICR0 and the PD3DDR.
The pin function is switched as shown below according to the combination of the PMEE bit of
LPC HICR0 and the PD2DDR.
The pin function is switched as shown below according to the combination of the LSMIE bit of
LPC HICR0 and the PD1DDR.
The pin function is switched as shown below according to the combination of the LSCIE bit of
LPC HICR0 and the PD0DDR.
PD3 input pin
PD2 input pin
PD1 input pin
PD0 input pin
0
0
0
0
0
0
0
0
PD3 output pin
PD2 output pin
PD1 output pin
PD0 output pin
1
1
1
1
Rev. 3.00, 03/04, page 241 of 830
GA20 output pin
LSMI output pin
PME output pin
LSCI output pin
1
0
1
0
1
0
1
0
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