DF2552BR26DV Renesas Electronics America, DF2552BR26DV Datasheet - Page 113
DF2552BR26DV
Manufacturer Part Number
DF2552BR26DV
Description
IC H8S/2552 MCU FLASH 176-LFBGA
Manufacturer
Renesas Electronics America
Series
H8® H8S/2500r
Specifications of DF2552BR26DV
Core Processor
H8S/2000
Core Size
16-Bit
Speed
26MHz
Connectivity
I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
104
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
176-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2552BR26DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 113 of 980
- Download datasheet (6Mb)
I/O
P1DDR
RAM0
I/O
P1DDR
RAM0
RAM locations are readable and writable, so there is no possibility of a problem if a bit-
manipulation instruction is used to clear only bit 4 of RAM0. Read the value from RAM0 and
then write it back to P1DDR.
MOV.B
MOV.B
Following this procedure in access to registers that include write-only bits makes the behavior
of the program independent of the type of instruction.
Output
Output
@RAM0,
R0L,
P17
P17
1
1
1
1
Output
Output
P16
P16
1
1
1
1
R0L
@P1DDR
Output
Output
P15
P15
1
1
1
1
Output
Input
P14
P14
1
0
0
0
Input
Input
P13
P13
0
0
0
0
Rev. 6.00 Sep. 24, 2009 Page 65 of 928
Input
Input
P12
P12
0
0
0
0
Input
Input
P11
P11
REJ09B0099-0600
0
0
0
0
Section 2 CPU
Input
Input
P10
P10
0
0
0
0
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