DF2339EVFC25 Renesas Electronics America, DF2339EVFC25 Datasheet - Page 297
DF2339EVFC25
Manufacturer Part Number
DF2339EVFC25
Description
IC H8S MCU FLASH 384K 144QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of DF2339EVFC25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2339EVFC25
HD64F2339EVFC25
HD64F2339EVFC25
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2339EVFC25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Instruction
Bcc
BCLR
BIAND
BILD
Mnemonic
BLE d:8
BRA d:16 (BT d:16)
BRN d:16 (BF d:16)
BHI d:16
BLS d:16
BCC d:16 (BHS d:16)
BCS d:16 (BLO d:16)
BNE d:16
BEQ d:16
BVC d:16
BVS d:16
BPL d:16
BMI d:16
BGE d:16
BLT d:16
BGT d:16
BLE d:16
BCLR #xx:3,Rd
BCLR #xx:3,@ERd
BCLR #xx:3,@aa:8
BCLR #xx:3,@aa:16
BCLR #xx:3,@aa:32
BCLR Rn,Rd
BCLR Rn,@ERd
BCLR Rn,@aa:8
BCLR Rn,@aa:16
BCLR Rn,@aa:32
BIAND #xx:3,Rd
BIAND #xx:3,@ERd
BIAND #xx:3,@aa:8
BIAND #xx:3,@aa:16
BIAND #xx:3,@aa:32
BILD #xx:3,Rd
BILD #xx:3,@ERd
BILD #xx:3,@aa:8
BILD #xx:3,@aa:16
BILD #xx:3,@aa:32
Instruction
Fetch
I
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
1
2
2
3
4
1
2
2
3
4
1
2
2
3
4
1
2
2
3
4
Branch
Address
Read
J
Rev. 4.00 Feb 24, 2006 page 281 of 322
Stack
Operation
K
Section 2 Instruction Descriptions
Byte Data
Access
L
2
2
2
2
2
2
2
2
1
1
1
1
1
1
1
1
Word Data
Access
M
REJ09B0139-0400
Internal
Operation
N
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
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