UPD70F3744GJ-GAE-AX Renesas Electronics America, UPD70F3744GJ-GAE-AX Datasheet - Page 789

• Manufacturer Part Number: UPD70F3744GJ-GAE-AX
• Description: MCU 32BIT V850ES/JX3 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Jx3r

Specifications of UPD70F3744GJ-GAE-AX

• Core Processor: RISC
• Core Size: 32-Bit
• Speed: 32MHz
• Connectivity: CSI, EBI/EMI, I²C, UART/USART
• Peripherals: DMA, LVD, PWM, WDT
• Number Of I /o: 128
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 2.85 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

V850ES/JJ3
R01UH0016EJ0400 Rev.4.00
Sep 30, 2010
Notes 1. Address values vary depending on the product.
0000290H
0000070H
0000060H
0000000H
2. This is the address when CSIB0 is used. It starts at 00002F0H when CSIB3 is used, and at 0000310H
3. Address values vary depending on the product.
Note 1
when UARTA0 is used.
Note 2
μ
μ
μ
μ
μ
μ
μ
μ
PD70F3743
PD70F3744
PD70F3745
PD70F3746
PD70F3743
PD70F3744
PD70F3745
PD70F3746
Figure 28-4. Memory Spaces Where Debug Monitor Programs Are Allocated
Interrupt vector for debugging
interrupt vector (4 bytes)
CSI0/UART receive
Security ID area
Internal ROM
Reset vector
(10 bytes)
(4 bytes)
(4 bytes)
(2 KB)
Internal ROM Size
Internal RAM Size
1024 KB
384 KB
512 KB
768 KB
32 KB
40 KB
60 KB
Internal ROM
area
00BF800H to 00BFFFFH
00FF800H to 00FFFFFH
005F800H to 005FFFFH
007F800H to 007FFFFH
Address Value
Address Value
3FF7000H
3FF5000H
3FF0000H
3FFEFFFH
3FFEFF0H
Note 3
CHAPTER 28 ON-CHIP DEBUG FUNCTION
Access-prohibited area
Internal RAM
(16 bytes)
: Debugging area
Internal RAM
area
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