MMC2107CFCPV33 Freescale Semiconductor, MMC2107CFCPV33 Datasheet - Page 25

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MMC2107CFCPV33

Manufacturer Part Number
MMC2107CFCPV33
Description
IC MCU 33MHZ 128K FLASH 144-LQFP
Manufacturer
Freescale Semiconductor
Series
MCorer
Datasheet

Specifications of MMC2107CFCPV33

Core Processor
M210
Core Size
32-Bit
Speed
33MHz
Connectivity
EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
72
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
SCI, SPI
Maximum Clock Frequency
33 MHz
Number Of Programmable I/os
32
Number Of Timers
4 bit
Operating Supply Voltage
0 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Lead Free Status / Rohs Status
No RoHS Version Available

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MMC2107 – Rev. 2.0
MOTOROLA
20.4
20.5
20.6
20.6.1
20.6.2
20.7
20.8
21.1
21.2
21.3
21.3.1
21.3.2
21.3.3
21.3.4
21.3.5
21.3.6
21.4
21.5
21.5.1
21.5.2
21.5.3
21.5.4
21.5.5
21.5.6
21.5.7
21.6
21.7
21.8
21.9
21.10 Non-Scan Chain Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . 547
21.11 Boundary Scan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 547
21.12 Low-Level TAP (OnCE) Module . . . . . . . . . . . . . . . . . . . . . . .553
Freescale Semiconductor, Inc.
For More Information On This Product,
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 523
Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 524
Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . 524
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 530
Interrupts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 531
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 533
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 535
Top-Level Test Access Port (TAP) . . . . . . . . . . . . . . . . . . . . . 537
Top-Level TAP Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . .540
Instruction Shift Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 541
IDCODE Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 545
Bypass Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 546
Boundary SCAN Register . . . . . . . . . . . . . . . . . . . . . . . . . . . .546
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 546
Section 21. JTAG Test Access Port and OnCE
Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 524
Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 525
Test Clock (TCLK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 538
Test Mode Select (TMS) . . . . . . . . . . . . . . . . . . . . . . . . . . 538
Test Data Input (TDI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 538
Test Data Output (TDO) . . . . . . . . . . . . . . . . . . . . . . . . . . . 538
Test Reset (TRST) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 538
Debug Event (DE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 538
EXTEST Instruction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 541
IDCODE Instruction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 542
SAMPLE/PRELOAD Instruction . . . . . . . . . . . . . . . . . . . . . 543
ENABLE_MCU_ONCE Instruction . . . . . . . . . . . . . . . . . . .543
HIGHZ Instruction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 544
CLAMP Instruction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 544
BYPASS Instruction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 544
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Table of Contents
Table of Contents
Technical Data
25

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