MMC2107CFCPV33 Freescale Semiconductor, MMC2107CFCPV33 Datasheet - Page 610

• Manufacturer Part Number: MMC2107CFCPV33
• Description: IC MCU 33MHZ 128K FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: MCorer

Specifications of MMC2107CFCPV33

• Core Processor: M210
• Core Size: 32-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 33 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 4 bit
• Operating Supply Voltage: 0 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No RoHS Version Available

Mechanical Specifications
23.3 Bond Pins
Technical Data
610
The MMC2107 die has a total of 144 bond pads. Of these, the pads that
are not bonded out in the 100-pin package are distributed around the
circumference of the die. This optional group of pins includes:
For more detailed information, see
Freescale Semiconductor, Inc.
For More Information On This Product,
A[22:0]
R/W
EB[3:0]
CSE[1:0]
TC[2:0]
OE
CS[3:0]
3 x V
3 x V
DD
SS
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Mechanical Specifications
Section 4. Signal
MMC2107 – Rev. 2.0
Description.
MOTOROLA