DSP56F826BU80 Freescale Semiconductor, DSP56F826BU80 Datasheet - Page 50

IC DSP 80MHZ 31.5K FLASH 100LQFP

DSP56F826BU80

Manufacturer Part Number
DSP56F826BU80
Description
IC DSP 80MHZ 31.5K FLASH 100LQFP
Manufacturer
Freescale Semiconductor
Series
56F8xxr
Datasheet

Specifications of DSP56F826BU80

Core Processor
56800
Core Size
16-Bit
Speed
80MHz
Connectivity
EBI/EMI, SCI, SPI, SSI
Peripherals
POR, WDT
Number Of I /o
46
Program Memory Size
67KB (33.5K x 16)
Program Memory Type
FLASH
Ram Size
4.5K x 16
Voltage - Supply (vcc/vdd)
2.25 V ~ 2.75 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-

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Please see www.freescale.com for the most current case outline.
50
C
-AB-
H
E
9
M °
DETAIL AD
W
0.15(0.006)
0.15(0.006)
AE
AE
X
Figure 4-2 100-pin LQPF Mechanical Information
-U-
-T-
K
S
GAUGE PLANE
(24X PER SIDE)
0.25 (0.010)
S
A
S
Q °
AB
AC
R
96X
T-U
T-U
G
S
0.100(0.004) AC
S
56F826 Technical Data, Rev. 14
Z
AD
Z
S
S
CASE 842F-01
0.20(0.008)
SECTION AE-AE
-Z-
SEATING
PLANE
-AC-
M
D
F
AC
T-U
S
N
Z
J
S
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
9.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: MILLIMETER.
DATUM PLANE -AB- IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING
LINE.
DATUMS -T-, -U-, AND -Z- TO BE DETERMINED
AT DATUM PLANE -AB-.
DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE -AC-.
DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 (0.010) PER SIDE.
DIMENSIONS A AND B DO INCLUDE MOLD
MISMATCH AND ARE DETERMINED AT
DATUM PLANE -AB-.
DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014). DAMBAR CAN NOT BE LOCATED
ON THE LOWER RADIUS OR THE FOOT.
MINIMUM SPACE BETWEEN PROTRUSION
AND AN ADJACENT LEAD IS 0.070 (0.003).
MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076 (0.003).
EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION.
DIM
W
G
H
K
M
Q
A 13.950 14.050
B 13.950 14.050
C
D
E
F
N
R
V 15.950 16.050
X
J
S 15.950 16.050
MILLIMETERS
1.400
0.170
1.350
0.170
0.050
0.090
0.500
0.090
0.150
MIN
0.500 BSC
0.200 REF
1.000 REF
12 REF
1
°
°
Freescale Semiconductor
1.600
0.270
1.450
0.230
0.150
0.200
0.700
0.160
0.250
MAX
5
°
0.549
0.549
0.055
0.007
0.053
0.007
0.002
0.004
0.020
0.004
0.006
0.628
0.628
MIN
0.020 BSC
0.008 REF
0.039 REF
INCHES
12 REF
1
°
°
MAX
0.553
0.553
0.063
0.011
0.057
0.009
0.006
0.008
0.028
0.006
0.010
0.632
0.632
5
°

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