MC68L11E1FNE2 Freescale Semiconductor, MC68L11E1FNE2 Datasheet - Page 183
MC68L11E1FNE2
Manufacturer Part Number
MC68L11E1FNE2
Description
IC MCU 8BIT 2MHZ 52-PLCC
Manufacturer
Freescale Semiconductor
Series
HC11r
Datasheet
1.MC711E9CFNE2R.pdf
(242 pages)
Specifications of MC68L11E1FNE2
Core Processor
HC11
Core Size
8-Bit
Speed
2MHz
Connectivity
SCI, SPI
Peripherals
POR, WDT
Number Of I /o
38
Program Memory Type
ROMless
Eeprom Size
512 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 8x8b
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
52-PLCC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Program Memory Size
-
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC68L11E1FNE2
Manufacturer:
ALLIANCE
Quantity:
6 274
Company:
Part Number:
MC68L11E1FNE2
Manufacturer:
Freescale Semiconductor
Quantity:
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11.6 52-Pin Windowed Ceramic-Leaded Chip Carrier (Case 778B)
Freescale Semiconductor
C
J
G
0.51 (0.020)
-A-
R
S
F
M
T
A
S
B
N
M68HC11E Family Data Sheet, Rev. 5.1
D
K
S
H
52 PL
0.18 (0.007)
-B-
0.51 (0.020)
-T-
0.15 (0.006)
SEATING
PLANE
M
M
T
T
A
52-Pin Windowed Ceramic-Leaded Chip Carrier (Case 778B)
A
S
S
B
B
S
S
NOTES:
1.
2.
3.
4.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION R AND N DO NOT INCLUDE
GLASS PROTRUSION. GLASS PROTRUSION
TO BE 0.25 (0.010) MAXIMUM.
ALL DIMENSIONS AND TOLERANCES
INCLUDE LEAD TRIM OFFSET AND LEAD
DIM
A
B
C
D
G
H
K
N
R
S
F
J
0.785
0.785
0.165
0.017
0.026
0.090
0.006
0.035
0.735
0.735
0.690
MIN
0.050 BSC
INCHES
0.795
0.795
0.200
0.021
0.032
0.130
0.010
0.045
0.756
0.756
0.730
MAX
19.94
19.94
18.67
18.67
17.53
MILLIMETERS
MIN
4.20
0.44
0.67
2.29
0.16
0.89
1.27 BSC
MAX
20.19
20.19
19.20
19.20
18.54
5.08
0.53
0.81
3.30
0.25
1.14
183
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