MC9S12XD256VAG Freescale Semiconductor, MC9S12XD256VAG Datasheet - Page 648
MC9S12XD256VAG
Manufacturer Part Number
MC9S12XD256VAG
Description
IC MCU 256K FLASH 144-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet
1.MC9S12XD64CAA.pdf
(1348 pages)
Specifications of MC9S12XD256VAG
Core Processor
HCS12X
Core Size
16-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
119
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
14K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 24x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 105°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
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Manufacturer
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Price
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Part Number:
MC9S12XD256VAG
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Chapter 17 Memory Mapping Control (S12XMMCV2)
17.5.3.4
In emulation expanded mode the external bus will be connected to the emulator and to the application. If
the ROMON bit is set, the internal FLASH provides the data. If the EROMON bit is set as well the
emulator observes all CPU internal actions, otherwise the emulator provides the data and traces all CPU
actions (see
the emulator will observe the CPU internal actions (see
648
Figure
ROM Control in Emulation Expanded Mode
1-30). When the ROMON bit is cleared, the application memory provides the data and
MCU
MCU
Figure 17-30. ROMON = 1 in Emulation Expanded Mode
Flash
MC9S12XDP512 Data Sheet, Rev. 2.21
Figure
Emulator
Application
Emulator
Application
1-31).
EROMON = 0
EROMON = 1
Memory
Memory
Flash
Observer
Generator
Freescale Semiconductor
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