AS1367-BTDT-45 austriamicrosystems, AS1367-BTDT-45 Datasheet - Page 2

• Manufacturer Part Number: AS1367-BTDT-45
• Description: IC REG LDO 150MA 4.5V 8-TDFN
• Manufacturer: austriamicrosystems

Specifications of AS1367-BTDT-45

• Package / Case: 8-UFDFN Exposed Pad
• Mounting Type: Surface Mount
• Current - Output: 150mA (Min)
• Voltage - Output: 4.5V
• Voltage - Input: Up to 5.5V
• Operating Temperature: -40°C ~ 85°C
• Regulator Topology: Positive Fixed
• Voltage - Dropout (typical): 0.11V @ 150mA
• Number Of Regulators: 1
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Limit (min): -

AS1367
Datasheet - P i n A s s i g n m e n t s
4 Pin Assignments
Figure 2. Pin Assignments (Top View)
Pin Descriptions
Table 1. Pin Descriptions
www.austriamicrosystems.com
Pin Name
OUT
GND
POK
GND
BYP
SET
EN
IN
Exposed Pad
Pin Number
7, 8
1
2
3
4
5
6
Regulated Output Voltage. The current flowing out of this pin is equivalent
to a DC load current. Fixed 1.2, 1.5, 1.8, 3.0, 3.3 and 4.5V output, as well as
versions from 1.2V up to 5.0V can be ordered.
Bypass this pin with 3.3µF to GND.
Bypass. This pin should be connected via a 10nF capacitor to pin OUT.
Set Input. Connect to GND for preset output. Connect to a resistive voltage-
divider between OUT and GND to set the output voltage between 1.2V and
5.0V.
Active-High Enable Input. A logic low reduces the supply current to < 1µA.
Connect this pin to pin IN for normal operation.
Ground. This pin also functions as a heat sink. Solder it to a large pad or to
the circuit-board ground plane to maximize power dissipation.
Power-OK Output. Active-low, open-drain output indicates an out-of-
regulation condition. Connect a 100kΩ pull-up resistor to pin OUT for logic
levels. Leave this pin unconnected if the Power-OK feature is not used.
Input Voltage. These pins should be connected to the positive terminal of
the input capacitor. Bypass this pin with 1µF to GND. Input voltage can
range from 2.0V to 5.5V.
Exposed Pad. This pin also functions as a heat sink. Solder it to a large pad
or to the circuit-board ground plane to maximize power dissipation. Internally
it is connected GND.
OUT
BYP
SET
EN
1
2
3
4
Revision 1.02
AS1367
Exposed
Pad
8 IN
7 IN
6 POK
5 GND
Description
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