P500-G200-WH Bourns Inc., P500-G200-WH Datasheet - Page 4
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P500-G200-WH
Manufacturer Part Number
P500-G200-WH
Description
SURGE SUPP TBU 200MA 500VIMP SMD
Manufacturer
Bourns Inc.
Series
TBU™r
Specifications of P500-G200-WH
Voltage - Working
300V
Technology
Mixed Technology
Number Of Circuits
2
Applications
SLIC
Package / Case
0.236" L x 0.157" W x 0.033" H (6mm x 4mm x 0.85mm)
Voltage Rating
500 V
Current Rating
200 mA
Height
0.85 mm
Length
6 mm
Mounting
SMD/SMT
Operating Temperature Range
- 40 C to + 85 C
Termination Style
SMD/SMT
Width
4 mm
Suppressor Type
Data Line / Mains
Output Current
400mA
Peak Surge Current
200mA
Response Time
1µs
Resistance
55ohm
Operating Temperature Max
85°C
Clamping Voltage Vc Max
500V
Length/height, External
0.85mm
Rohs Compliant
Yes
External Depth
4mm
External Width
6mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power (watts)
-
Voltage - Clamping
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
P500-Gxxx
P850-Gxxx
Pads 1A and 1 are internally connected; the same for pads 3A with 3, 4A with 4, and 6A with 6.
This allows for one PCB layout to accommodate the P500 or P850.
P500-Gxxx
P850-Gxxx
TBU
defi ne (NSMD). Recommended stencil thickness is 0.10-0.12 mm (.004-.005 in.) with stencil
opening size 0.025 mm (.0010 in.) less than the device pad size. As when heat sinking any power
device, it is recommended that, wherever possible, extra PCB copper area is allowed. For mini-
mum parasitic capacitance, do not allow any signal, ground or power signals beneath any of the
pads of the device.
A
Product Dimensions
Recommended Pad Layout
(.048)
1.225
(.048)
1.225
®
TBU
devices have matte-tin termination fi nish. Suggested layout should use non-solder mask
(.015)
0.375
A
(.033)
(.015)
0.375
0.85
(.050)
1.275
(.012)
0.30
PIN 1
®
(.030)
0.75
P500-G and P850-G Protectors
TOP VIEW
TOP VIEW
PIN 1
B
B
(.049)
1.25
(.030)
0.75
(.045)
1.15
(.045)
1.15
C
C
SIDE VIEW
SIDE VIEW
D
D
J
J
G
K
4A
3A
4
3
E
NC = Solder to PCB; do not make electrical
connection, do not connect to ground.
NC = Solder to PCB; do not make electrical
connection, do not connect to ground.
4
3
L
BOTTOM VIEW
Pad #
E
BOTTOM VIEW
1A
3A
1
2
3
K
5
2
K
5
2
F
Pad #
Tip Out
Tip Out
J
F
6
1
Pad Designation
Apply
1
2
3
4
5
6
E
Tip In
Tip In
Pad Designation
NC
K
6
1
L
E
H
M
6A
1A
N
N
Ring Out
Tip Out
Ring In
G
Apply
Tip In
Pad #
H H
NC
NC
4A
6A
J
4
5
6
M
N
N
Customers should verify actual device performance in their specifi c applications.
Ring Out
Ring Out
Ring In
Ring In
Apply
NC
Dim.
M
B
C
D
G
H
K
N
A
E
F
J
L
P500-Gxxx
P850-Gxxx
(.139)
(.232)
(.031)
0.000
(.000)
(.045)
(.041)
(.043)
0.375
(.015)
(.028)
(.028)
0.375
(.015)
Min.
5.90
0.80
1.15
1.05
1.10
0.70
0.70
Block Diagram
3.40
Specifi cations are subject to change without notice.
--
--
P500-G
6 & 6A
1 & 1A
DIMENSIONS:
(.157)
(.236)
(.033)
0.025
(.001)
(.049)
(.045)
(.047)
0.425
(.017)
(.030)
(.030)
0.425
(.017)
Typ.
4.00
1.25
1.15
1.20
0.75
0.75
6
6.00
0.85
1
--
--
0.050
0.475
0.475
(.161)
(.240)
(.035)
(.002)
(.053)
(.049)
(.051)
(.019)
(.031)
(.031)
(.018)
Max.
4.10
6.10
0.90
1.35
1.25
1.30
0.80
0.80
--
--
(INCHES)
(.139)
(.321)
(.031)
0.000
(.000)
(.045)
(.041)
0.725
(.029)
(.043)
0.375
(.015)
(.010)
(.028)
(.028)
0.375
(.015)
Min.
3.40
8.15
0.80
1.15
1.05
1.10
0.25
0.70
0.70
MM
P850-G
0.025
0.825
0.425
0.425
(.157)
(.325)
(.033)
(.001)
(.049)
(.045)
(.032)
(.047)
(.017)
(.012)
(.030)
(.030)
(.017)
Typ.
4.00
8.25
0.85
1.25
1.15
1.20
0.30
0.75
0.75
3 & 3A
4 & 4A
4
3
(.161)
(.329)
(.035)
0.050
(.002)
(.053)
(.049)
0.925
(.036)
(.051)
0.475
(.019)
(.014)
(.031)
(.031)
0.475
(.018)
Max.
4.10
8.35
0.90
1.35
1.25
1.30
0.35
0.80
0.80