MAX15029ATB+T Maxim Integrated Products, MAX15029ATB+T Datasheet - Page 2

• Manufacturer Part Number: MAX15029ATB+T
• Description: IC REG LDO ADJ 500MA 10-TDFN
• Manufacturer: Maxim Integrated Products

Specifications of MAX15029ATB+T

• Regulator Topology: Positive Adjustable
• Voltage - Output: 0.5 ~ 3.3 V
• Voltage - Input: 1.43 ~ 3.6 V
• Voltage - Dropout (typical): 0.04V @ 500mA
• Number Of Regulators: 1
• Current - Output: 500mA
• Current - Limit (min): 700mA
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 10-TDFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
IN, FB, SS, I.C. to GND..........................................-0.3V to +4.0V
BIAS to GND.............................................................-0.3V to +6V
EN to GND ................-0.3V to the lower of (V
OUT to GND ................................................-0.3V to (V
Output Short-Circuit Duration.....................................Continuous
Continuous Power Dissipation (T
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
1.425V to 3.6V Input, 500mA Low-Dropout
Regulators with BIAS Input
ELECTRICAL CHARACTERISTICS
(Circuit of Figure 1; V
+125°C. Typical values are at T
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
IN
Input Voltage Range
Undervoltage Lockout
Undervoltage Lockout Hysteresis
Quiescent GND Current
Input Supply Current in Shutdown
BIAS (MAX15030)
Input Voltage Range
Undervoltage Lockout
Undervoltage Lockout Hysteresis
Quiescent Input Supply Current
Input Supply Current in Shutdown
TDFN (derate 24.4mW/°C above +70°C)....................1951mW
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
_______________________________________________________________________________________
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
IN
= 1.8V, V
A
A
= +25°C, unless otherwise noted.) (Note 2)
OUT
= +70°C)
V
V
SYMBOL
UVLO_HYST
BIAS_UVLO
= 1.2V, EN = IN for MAX15029, EN = BIAS for MAX15030, I
I
BIAS_SD
V
I
V
I
I
IN_SD
UVLO
BIAS
V
GND
BIAS
JC
IN
BIAS
) ...................9°C/W
JA
) ............41°C/W
+ 0.3V) or +6V
MAX15029
MAX15030
V
I
V
I
V
V
V
V
I
V
EN = GND
OUT
OUT
OUT
IN
IN
IN
IN
EN
BIAS
EN
IN
rising
= 1.425V to 3.6V, V
= 3.6V, V
= 3.3V, V
= 0V (T
= V
+ 0.3V)
= 2mA
= 1mA, V
= 2mA
rising
BIAS
A
OUT
OUT
= -40°C to +85°C)
CONDITIONS
BIAS
= 3.3V, I
= 3.3V, I
Operating Junction Temperature Range ...........-40°C to +125°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
= 3.3V
V
V
V
V
V
V
V
BIAS = IN
MAX15029
MAX15030
IN
BIAS
IN
BIAS
IN
BIAS
BIAS
OUT
= 0V, V
= 3.3V, V
= 3.3V, V
OUT
OUT
= 3.3V
= 5V
= 3.3V
= 3V to 5.5V
= 1.2V,
= 100mA
= 500mA
OUT
OUT
OUT
= 0V,
= 0V,
= 0V,
1.425
1.425
3.000
1.275
1.04
MIN
160
180
170
2.3
20
OUT
3
= 100mA, T
1.325
TYP
1.09
275
325
315
110
0.1
2.5
1.2
1.2
1.5
50
60
A
3.600
3.600
3.600
1.375
MAX
1.14
410
560
470
120
5.5
5.5
2.7
= T
2
2
3
J
= -40°C to
UNITS
mV
mV
μA
μA
μA
μA
V
V
V
V