USBULC6-2F3 STMicroelectronics, USBULC6-2F3 Datasheet - Page 7
USBULC6-2F3
Manufacturer Part Number
USBULC6-2F3
Description
IC ESD PROTECTION ASD 4FLIPCHIP
Manufacturer
STMicroelectronics
Datasheet
1.USBULC6-2F3.pdf
(9 pages)
Specifications of USBULC6-2F3
Voltage - Reverse Standoff (typ)
3V
Voltage - Breakdown
6V
Power (watts)
60W
Polarization
2 Channel Array - Bidirectional
Mounting Type
Surface Mount
Package / Case
4-FlipChip
Applications
USB
Number Of Circuits
2
Voltage - Working
6V
Technology
Diode Array
Mounting Style
SMD/SMT
Diode Type
Low Capacitance
Power Dissipation Pd
60W
Diode Case Style
Flip Chip
No. Of Pins
4
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Clamping
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-8166-2
USBULC6-2F3
USBULC6-2F3
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
USBULC6-2F3
Manufacturer:
STM
Quantity:
3 232
Part Number:
USBULC6-2F3
Manufacturer:
ST
Quantity:
20 000
Company:
Part Number:
USBULC6-2F3E/7
Manufacturer:
MAXIM
Quantity:
208
Part Number:
USBULC6-2F3K
Manufacturer:
高价回收此型号
Quantity:
20 000
USBULC6-2F3
Note:
5
Figure 20. Flip Chip tape and reel specifications
More information is available in the application notes:
AN2348: “400 µm Flip Chip: Package description and recommendations for use”
AN1751: "EMI Filters: Recommendations and measurements"
Ordering information
Table 3.
Figure 18. Footprint recommendations
USBULC6-2F3
Order code
Solder stencil opening :
Copper pad Diameter:
260 µm maximum
Solder mask opening:
300 µm minimum
220 µm recommended
220 µm recommended
Ordering information
All dimensions in mm
0.71
Marking
EH
Dot identifying Pin A1 location
Package
Flip Chip
User direction of unreeling
Figure 19. Marking
Dot
xx = marking
z = manufacturing location
yww = datecode
1.16 mg
Weight
4 ± 0.1
1.02
(y = year
ww = week)
4 ± 0.1
Base qty
5000
Ø 1.5 ± 0.1
Ordering information
x
y
Tape and reel (7”)
Delivery mode
w
x
w
z
7/9