AXT650124 Panasonic Electric Works, AXT650124 Datasheet - Page 119

• Manufacturer Part Number: AXT650124
• Description: CONN HEADER F4S .4MM 50POS SMD
• Manufacturer: Panasonic Electric Works
• Series: F4Sr

Specifications of AXT650124

• Connector Type: Header, Center Strip Contacts
• Number Of Positions: 50
• Pitch: 0.016" (0.40mm)
• Number Of Rows: 2
• Mounting Type: Surface Mount
• Features: Solder Retention
• Contact Finish: Gold
• Mated Stacking Heights: 1mm
• Height Above Board: 0.033" (0.84mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Contact Finish Thickness: -
• Other names: 255-2399-2

AXC5
2. Safety precautions
Observe the following safety precautions
to prevent accidents and injuries.
1) The use of the connector outside of the
specified rated current and withstand
voltage ranges may cause abnormal
heating, smoke, and fire. Never use the
connector beyond the specified ranges of
the product.
2) In order to avoid accidents, make sure
you have thoroughly reviewed the
specifications before use.
Consult us if you plan to use the product
in a way not covered by the
specifications.
3. Precautions for harnessing and
header assembly
The header of this product is wired by
soldering the 0.3 mm pitch cable. If
harnessing is desired, then carry it out
based on the separately attached
“Header Assembly Procedures”. Make
sure to get familiar with and observe all
the precautions in the procedures.
4. PC board design
Design the recommended foot pattern in
order to secure the mechanical strength
in the soldered areas of the terminal.
5. Connector mounting
In case the connector is picked up by
chucking during mounting, an excessive
mounter chucking force may deform the
molded or metal part of the connector.
Consult us in advance if chucking is to be
applied.
6. Soldering
1) Manual soldering.
• Since this is a low-profile product, avoid
supplying too much solder when
soldering manually. Otherwise, solder
may creep into the vicinity of the contact
portion, or the contact can lose its
springing ability.
• Make sure that the soldering iron tip is
heated within the temperature and time
limits indicated in the specifications.
• Flux from the solder wire may adhere to
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any flux before use.
• Be aware that a load applied to the
connector terminals while soldering may
displace the contact.
• Thoroughly clean the iron tip.
2) Reflow soldering
• Screen-printing is recommended for
printing paste solder.
• To determine the relationship between
the screen opening area and the PC-
board foot pattern area, refer to the
diagrams in the recommended patterns
for PC boards and metal masks. Make
sure to use the terminal tip as a reference
position when setting.
122
Matsushita Electric Works, Ltd.
• Consult us when using a screen-printing
thickness other than that recommended.
• Depending on the size of the connector
being used, self alignment may not be
possible. Accordingly, carefully position
the terminal with the PC board pattern.
• The recommended reflow temperature
profile is given in the figure below
• The temperature is measured on the
surface of the PC board near the
connector terminal.
• When performing reflow soldering on
the back of the PC board after reflow
soldering the connector, secure the
connector using, for example, an
adhesive (Double reflow soldering on the
same side is possible)
3) Reworking on a soldered portion
• Finish reworking in one operation.
• For reworking of the solder bridge, use
a soldering iron with a flat tip. Do not add
flux, otherwise, the flux may creep to the
contact parts.
• Use a soldering iron whose tip
temperature is within the temperature
range specified in the specifications.
7. Prevention of vibration and shock
1) Since this product has a particularly
low-profile, is compact and lightweight, its
molded parts are thinned. To prevent the
connector from detaching due to vibration
and shock, make sure to consider means
to avoid applying tension to the connector
such as by providing a stopper to fix the
connector toward the mating direction or
fixing the wire.
2) Do not drop the product or handle it
carelessly. Otherwise, the terminals may
become deformed due to excessive force
or the solderability during reflow
soldering may degrade.
3) Do not insert or remove the connector
when it is not soldered. Also, forcibly
applied external pressure on the
terminals can weaken the adherence of
the terminals to the molded part or cause
the terminals to lose their evenness.
150 to 175°C
155 to 165°C
Temperature
Temperature
245°C max.
260°C max.
Recommended reflow temperature profile
Recommended reflow temperature profile
(lead-free solder)
(eutectic solder)
Preheating
Preheating
120 sec.
60 to 120 sec.
Peak temperature
Peak temperature
200°C
Time
180 to 200°C
Time
70 sec.
Within 30 sec.
4) Excessive twisting during insertion and
removal can lead to product damage and
separation of the terminals’ soldered
part. An excessive force applied around
the mating inlet during mating can also
lead to product damage. Therefore, be
careful when handling the product, and
during mating, always align the mating
positions and mate in parallel.
5) Do not pull the wires when unmating
the connector. Doing so may damage the
product or degrade the locking ability.
Unmate the connector by referring to the
figure below.
Removal of this product requires a
header removal tool. Please inquire for
details.
6) After harnessing, be careful not to
apply any excessive stress to the wire
roots.
7) Keep the PC board warp within 0.03
mm with respect to the total length of the
connector.
8) The positioning boss of this product is
for rough positioning with the PC board.
For accurate positioning when mounting
the connector to a PC board, we
recommend positioning by an automated
machine.
Insert the unmating jig and, with the lock released,
lift it directly up.
0.03 mm max.
Unmating jig
insertion position
Do not apply any excessive stress
to the wire roots.
Unmating jig
http://www.mew.co.jp/ac/e/
0.03 mm max.
Shell