AXT650124 Panasonic Electric Works, AXT650124 Datasheet - Page 149

• Manufacturer Part Number: AXT650124
• Description: CONN HEADER F4S .4MM 50POS SMD
• Manufacturer: Panasonic Electric Works
• Series: F4Sr

Specifications of AXT650124

• Connector Type: Header, Center Strip Contacts
• Number Of Positions: 50
• Pitch: 0.016" (0.40mm)
• Number Of Rows: 2
• Mounting Type: Surface Mount
• Features: Solder Retention
• Contact Finish: Gold
• Mated Stacking Heights: 1mm
• Height Above Board: 0.033" (0.84mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Contact Finish Thickness: -
• Other names: 255-2399-2

AXJ5
EMBOSSED TAPE DIMENSIONS
• Tape dimensions (Conforming to JIS C 0806-3 1990)
NOTES
1. Use of a cover is recommended
when using this device in order to
prevent scraps, dust, dirt, etc., from
getting inside of the receptacle.
2. PC board design
Please refer to the recommended PC
board pattern to ensure the strength of
soldered portion of terminals.
3. Soldering
1) Manual soldering
• Please set up temperature and applied
time of soldering iron as indicated in
specification sheet.
• Avoid an excessive amount of solder
from being applied, or it may flow into the
shell.
• Please use soldering iron after
confirming removal of dispersed solder
flux on the contact surface by use of
magnifying glass after each soldering.
• Do not apply a load to the terminals
during soldering, or the contacts may be
displaced.
• Please properly clean soldeing iron.
2) Reflow soldering
• Screen printing is recommended for
cream solder printing.
• Screen thickness of 0.12mm is
recommended for cream solder printing.
• When applying different thickness of
screen, please consult us.
• Depending upon size of connector, self
alignments may not be expected.
Please pay attention to align terminals
and soldered pads.
152
Matsushita Electric Works, Ltd.
(24.0±0.3)
(11.5)
1.75
1.55±0.05 dia.
• The following diagram shows the
recommended reflow soldering
temperature profile.
Recommended reflow soldering
temperature profile
• The temperature measured on the PC
board surface near connector terminals.
• After reflow soldering, in case of PC
board surface the reverse side using
reflow soldering, for example an adhesive
and so on connector of fixed disposition.
3) Rework of soldering portion
• Rework is one time.
• Avoid an excessive amount of solder
from being applied, or it may flow into the
shell.
• In case of soldering rework of bridges.
Please use a flat-head soldering iron and
don’t use supplementary solder flux.
• Please use the soldering iron under
specification’s temperature
4. Since excessive force on the
terminals will cause deformation and
the integrity of the soldering will be
lost during reflow soldering, avoid
dropping or rough handling of the
product.
150 to 175°C
Temperature
Max. 260°C
(unit: mm)
Pre-heating
60 to 120 second
• Reel dimensions (Conforming to EIAJ ET-7200B)
Maximum temperature
(25.4±1)
Time
200°C
Max. 70 sec
5. PC board warpage should be
controlled less than 0.03mm to entire
length of the connector.
6. Repeated bending of terminals and
clips (retention fitting) can result in
terminals breaking.
7. Regarding after soldering
connectors on PC boards
• After mounting connectors on PC
boards, do not apply excessive loads to
the connector by piling up the boards.
• Please do not add the force to the
connector during assembled connector
on PC board.
8. This connector has metal shell for
preventing EMI, when designing an
enclosure the followings should be
considered. Guide for plug entrance
should be arranged in order to prevent
distorted insertions. Provide a cover
to reinforce the metal shell portions of
the receptacle.
9. Others
To prevent insulation deterioration of PC
board after soldering, please avoid
adhesion coating agent to terminals in
case of coating.
For other details, please verify with
the product specification sheets.
http://www.mew.co.jp/ac/e/
Top cover tape
Emboss carrier tape