AXT650124 Panasonic Electric Works, AXT650124 Datasheet - Page 184

• Manufacturer Part Number: AXT650124
• Description: CONN HEADER F4S .4MM 50POS SMD
• Manufacturer: Panasonic Electric Works
• Series: F4Sr

Specifications of AXT650124

• Connector Type: Header, Center Strip Contacts
• Number Of Positions: 50
• Pitch: 0.016" (0.40mm)
• Number Of Rows: 2
• Mounting Type: Surface Mount
• Features: Solder Retention
• Contact Finish: Gold
• Mated Stacking Heights: 1mm
• Height Above Board: 0.033" (0.84mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Contact Finish Thickness: -
• Other names: 255-2399-2

EMBOSSED TAPE AND REEL
• Tape dimensions
NOTES
1. Regarding the design of PC board
patterns
Conduct the recommended foot pattern
design, in order to preserve the
mechanical strength of terminal solder
areas.
2. Regarding the socket mounting
1) When reflow soldering when the slider
is locked, heat will cause the slider to
deform and not work. Therefore, please
confirm that the slider lock is released
before mounting if you have inserted and
removed a card before soldering.
2) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
3. Soldering
1) Reflow soldering
(1) Screen-printing method is
recommended for cream solder printing.
(2) Use the recommended foot pattern for
cream solder printing (screen thickness:
0.15 mm).
(3) When applying the different thickness
of a screen, please consult us.
(4) Use the recommended reflow
temperature profile conditions shown on
the right for infrared reflow soldering.
(5) Measure the temperature at the
connector surface.
2) Hand soldering
Set the soldering tip to 300°C, and solder
for no more than 5 seconds.
http://www.mew.co.jp/ac/e/
155 to 165°C
Temperature
250°C max.
A-A cross section
Emboss
carrier tape
Top cover
tape
Preheating
60 to 120 sec.
Peak temperature
A
Time
180 to 200°C
Within 30 sec.
(40.40)
(44.00)
A
(20.20)
(1.75)
Socket for miniSD card
4. Cleaning after soldering
Inside the socket there is a slider section
and card detection contact/write
protection mechanism. If anything such
as flux remains inside after washing,
insertion and removal will be hampered
and contact will be faulty. Therefore, do
not use methods that involve submersion
when cleaning. (Partial cleaning of the
PCB and soldered terminals is possible.)
5. After PC board mounting
1) Warping of the PC board should be no
more than 0.03 mm for the entire
connector length.
2) When assembling PCBs or storing
them in block assemblies, make sure that
undue weight is not exerted on a stacked
connector.
3) Be sure not to allow external pressure
to act on connectors when assembling
PCBs or moving in block assemblies.
6. Handling single components
1) Make sure not to drop or allow parts to
fall from work bench
2) Be cautious when handling because
excessive force applied to the terminals
will cause deformation and loss of
terminal coplanarity.
3) Repeated bending of the terminals
may break them.
7. Card fitting
1) These products are made for the
design of compact and lightweight
devices and therefore the molded part is
very thin. For this reason, design the
device to prevent undue wrenching forces
from being applied to the product during
use.
(Unit: mm)
• Reel dimensions (Conforming to JIS C 0806-1995)
(44.4 )
+2
0
Taping reel
Matsushita Electric Works, Ltd.
2) The sockets are constructed to prevent
reverse card insertion. Caution is
required because repeated, mistaken
reverse insertion may damage the socket
and card.
3) When not soldered, be careful not to
insert and remove the socket's card.
Doing so will cause a decrease in
anchoring ability of the mated part and
loss of coplanarity.
4) Forcibly removing a fitted card may
degrade the card removal prevention
lock. To remove a card, be sure to push
the card in the insertion direction to
release the slider lock before pulling out
the card.
8. Device design
1) Contact failure may result if dust or dirt
enters the contact section. Please take
appropriate measures when designing
the device to prevent this from
happening, for example by adding a
cover.
2) To ensure smooth insertion and
removal of cards, please design the
chassis so that no force is applied to the
metal shell on top of the socket. If a force
is present that pushes down on the metal
shell, the card will be pressed, which
might prevent ejection.
3) Please provide a guide or similar to
keep the socket from having force applied
to it when inserting and removing.
9. Others
If you coat the PCB after soldering for
insulation and to prevent wear, make sure
that the coating does not adhere to the
socket.
Regarding general notes, please refer
to page 17.
For other details, please verify with the
product specification sheets.
Top cover tape
Label
Tape
Emboss carrier tape
Cavity
(AXA1)
187