AXT650124 Panasonic Electric Works, AXT650124 Datasheet - Page 186

• Manufacturer Part Number: AXT650124
• Description: CONN HEADER F4S .4MM 50POS SMD
• Manufacturer: Panasonic Electric Works
• Series: F4Sr

Specifications of AXT650124

• Connector Type: Header, Center Strip Contacts
• Number Of Positions: 50
• Pitch: 0.016" (0.40mm)
• Number Of Rows: 2
• Mounting Type: Surface Mount
• Features: Solder Retention
• Contact Finish: Gold
• Mated Stacking Heights: 1mm
• Height Above Board: 0.033" (0.84mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Contact Finish Thickness: -
• Other names: 255-2399-2

SPECIFICATIONS
1. Characteristics (Complies with miniSD™ card and application note specification Ver. 1.0.)
2. Material and surface treatment
3. Applicable memory card and socket
DIMENSIONS
Note: An indication, such as a logo, specified by the customer can be marked on the
http://www.mew.co.jp/ac/e/
Electrical
characteristics
Mechanical
characteristics
Lifetime
characteristics
Environment
characteristics
Unit weight
CAD Data
SD logo-printed surface through a separate agreement on the specifications.
Cards complying with miniSD™ card specification Ver. 1.02.
Signal contact
Portion
Movable angle
Rated current
Contact resistance
Insulation resistance
Breakdown voltage
Vibration resistance
Insertion and removal force of
miniSD™ card
Insertion and removal force of
adapter
Insertion and removal life of
miniSD™ card and adapter
Ambient temperature
Storage temperature
Humidity tolerance (mated
condition)
Item
(Unit: mm)
Memory card
mini SD memory card
16.0
24.0±0.1
0.5A/1 terminal
Max. 100mΩ
Min. 1,000MΩ (Initial)
500V AC for 1 min. (Initial)
No current interruption for more than 0.1 µs
Insertion force: Max. 40N {4.08kgf}
Removal force: Min. 1N {0.10kgf},
Insertion force: Max. 40N {4.08kgf}
Removal force: Min. 1N {0.10kgf}, Max. 40N {4.08kgf}
Insertion and removal life: 10,000 times
Contact resistance after testing: Max. 100mΩ
–25°C to +85°C
–40°C to +85°C
(The allowable storage temperature is –40°C to +50°C
if unopened from original packaging)
Contact resistance: Max. 100mΩ
Insulation resistance: Min. 100MΩ
1.40g
22.5
Copper alloy
12.0
20.1
Material
–0.1
14.5
The CAD data of the products with a
0
8.0
12.0
4.0
Max. 40N {4.08kgf}
Specifications
Area where logo, etc.,
can be printed
(0.02 mm recess)
Contact portion: Ni plating on base, PdNi + Au plating on surface
Sockets complying with SD memory card specification Ver. 2.0.
CAD Data
Part No./Country of origin/Lot
6 × P2.5 = 15.0
Matsushita Electric Works, Ltd.
mark can be downloaded from: http://www.mew.co.jp/ac/e
Measured based on the HP4338B measurement
method of JIS C 5402
Using 500V DC megger (applied for 1 min.)
Rated voltage is applied for one minute and check for
short circuit or damage with a detection current of 1 mA.
Frequency: 10 to 2,000 Hz
Acceleration: 20.0 m/s
Measured while mated with SD memory card socket
mounted on evaluation board.
Force required for insertion and removal of miniSD™
card to and from miniSD™ adapter.
Force required for insertion and removal into and out of
SD memory card socket with a miniSD™ card mated.
Insertion and removal speed are at a rate of 400 times/
hour or less.
No freezing or condensation in low temperatures
No freezing or condensation in low temperatures
MIL-STD-1344A, METHOD 1002
Temperature: 40±2°C,
Humidity: 90 to 95%RH,
Test time: 500 hours
Max.13.0
10.0
2.425
Surface
Socket
1.70
2
{2.0G}
Condition
Write enabled
Write abled
(AXA1)
189