AXT650124 Panasonic Electric Works, AXT650124 Datasheet - Page 189

• Manufacturer Part Number: AXT650124
• Description: CONN HEADER F4S .4MM 50POS SMD
• Manufacturer: Panasonic Electric Works
• Series: F4Sr

Specifications of AXT650124

• Connector Type: Header, Center Strip Contacts
• Number Of Positions: 50
• Pitch: 0.016" (0.40mm)
• Number Of Rows: 2
• Mounting Type: Surface Mount
• Features: Solder Retention
• Contact Finish: Gold
• Mated Stacking Heights: 1mm
• Height Above Board: 0.033" (0.84mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Contact Finish Thickness: -
• Other names: 255-2399-2

(AXA4)
ORDERING INFORMATION
4: Sockets for microSD™ card
<Board mounting direction>
6: Reverse type (outside terminal)
<Eject type>
3: Push-push type
<Stand off height>
0: Not available (0.05 mm)
7: –0.95 mm (for PCB cut-off type)
<Function>
(Card jump-out prevention function/Card presence detection switch/
RF terminal)
<Terminal/Retention fitting/Positioning boss>
<Packing>
P: Embossed tape
PRODUCT TYPES
SPECIFICATIONS
1. Characteristics (Performance when microSD™ card is mated. Based on microSD™ card specification Ver. 1.0.)
192
Electrical
characteristics
Mechanical
characteristics
Lifetime
characteristics
Environment
characteristics
Applicable memory card
Unit weight
5
6
1
2
4
microSD™ card
Product name
Sockets for
prevention function
Signal terminal
Card jump-out
Available
Available
Matsushita Electric Works, Ltd.
SMD
SMD
SMD
Push-push
Eject type
Rated voltage
Rated current
Contact resistance
Insulation resistance
Breakdown voltage
Vibration resistance
Card locking force
Insertion and removal life of
card
Ambient temperature
Storage temperature
Resistance to soldering heat
type
Item
Retention fitting
detection switch
Card presence
AXA
SMD
SMD
detection
Available
DIP
Available
Available
Card
4
Card jump-out
prevention
With positioning bosses
Without positioning bosses
Without positioning bosses
Available
function
6
Positioning bosses
3.6V DC
0.5A DC/1 terminal
Signal contact portion: Max. 100mΩ
Detection contact portion: Max. 500mΩ
Min. 1,000MΩ
500V AC for 1 min.
Frequency: 10 to 55 Hz
Acceleration: 20.0 m/s
No current interruption for more than 0.1 µs
Max. 40N {4.08kgf}
Mechanical life: 10,000 times
After testing:
–25°C to +85°C
–40°C to +85°C
(The allowable storage temperature is –40°C to +50°C
if unopened from original packaging)
Reflow soldering: peak temperature 260°C or less
Manual soldering: soldering iron tip temperature 300°C,
5 sec. or less
microSD™ card (based on specification Ver. 1.10) and Trans Flash card
0.65g
Contact resistance: Max. 40mΩ
Insulation resistance: Max. 100MΩ
Not available
RF terminal
Available
3
Without positioning
Positioning bosses
With positioning
bosses
bosses
—
Specifications
2
{2.0G}
Not available
RF terminal
Available
P
On board mounting
Mounting type
reverse type
reverse type
PCB cut-off
Measured based on the HP4338B measurement method
of JIS C 5402
Using 500V DC megger (applied for 1 min.)
Rated voltage is applied for one minute and check for
short circuit or damage with a detection current of 1 mA.
Insertion and removal speed are at a rate of 500 times/
hour or less.
No freezing or condensation in low temperatures
No freezing or condensation in low temperatures
Sockets (shell) surface temperature for using infrared
reflow soldering machine
AXA463754P
AXA463051P
AXA463061P
AXA463062P
Part No.
Condition
http://www.mew.co.jp/ac/e/
1,000 pieces
Inner carton
(1 reel)
Packing quantity
2,000 pieces
Outer carton
(2 reels)