PK20N512VLK100 Freescale Semiconductor, PK20N512VLK100 Datasheet - Page 17

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PK20N512VLK100

Manufacturer Part Number
PK20N512VLK100
Description
IC ARM CORTEX MCU 512K 80-LQFP
Manufacturer
Freescale Semiconductor
Series
Kinetisr
Datasheet

Specifications of PK20N512VLK100

Core Processor
ARM Cortex-M4
Core Size
32-Bit
Speed
100MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SDHC, SPI, UART/USART, USB, USB OTG
Peripherals
DMA, I²S, LVD, POR, PWM, WDT
Number Of I /o
52
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
1.71 V ~ 3.6 V
Data Converters
A/D 33x16b, D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
80-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PK20N512VLK100
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
1. Determined according to IEC Standard 61967-1, Integrated Circuits - Measurement of Electromagnetic Emissions, 150
2. V
3. Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband
5.1.7 Designing with radiated emissions in mind
To find application notes that provide guidance on designing your system to minimize
interference from radiated emissions:
5.1.8 Capacitance attributes
5.2 Switching specifications
5.2.1 Device clock specifications
Freescale Semiconductor, Inc.
1. Go to http://www.freescale.com.
2. Perform a keyword search for “EMC design.”
f
FB_CLK
Symbol
SYS_USB
kHz to 1 GHz Part 1: General Conditions and Definitions, IEC Standard 61967-2, Integrated Circuits - Measurement of
Electromagnetic Emissions, 150 kHz to 1 GHz Part 2: Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method, and SAE Standard J1752-3, Measurement of Radiated Emissions from Integrated Circuits—TEM/
Wideband TEM (GTEM) Cell Method.
TEM Cell Method, and Appendix D of SAE Standard J1752-3, Measurement of Radiated Emissions from Integrated
Circuits—TEM/Wideband TEM (GTEM) Cell Method.
f
Symbol
FLASH
f
f
f
C
C
DD
SYS
BUS
SYS
IN_A
IN_D
= 3 V, T
System and core clock
System and core clock when USB in operation
Bus clock
FlexBus clock
Flash clock
System and core clock
Description
A
Input capacitance: analog pins
Input capacitance: digital pins
Description
= 25 °C, f
OSC
K20 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
= 12 MHz (crystal), f
Table 8. Capacitance attributes
Table continues on the next page...
SYS
Normal run mode
= 96 MHz
Preliminary
VLPR mode
Min.
20
Min.
Max.
100
50
50
25
2
Max.
7
7
MHz
MHz
MHz
MHz
MHz
MHz
Unit
Unit
Notes
pF
pF
General
17

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