PK20N512VLK100 Freescale Semiconductor, PK20N512VLK100 Datasheet - Page 19

• Manufacturer Part Number: PK20N512VLK100
• Description: IC ARM CORTEX MCU 512K 80-LQFP
• Manufacturer: Freescale Semiconductor
• Series: Kinetisr

Specifications of PK20N512VLK100

• Core Processor: ARM Cortex-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SDHC, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I²S, LVD, POR, PWM, WDT
• Number Of I /o: 52
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 128K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 33x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 80-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

5.3.1 Thermal operating requirements
5.3.2 Thermal attributes
1.
6 Peripheral operating requirements and behaviors
All digital I/O switching characteristics assume:
6.1 Core modules
Freescale Semiconductor, Inc.
Single-
layer (1s)
Four-layer
(2s2p)
Single-
layer (1s)
Four-layer
(2s2p)
—
—
—
1. output pins
2. input pins
Board
Symbol
type
T
T
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
J
A
• have C
• are configured for fast slew rate (PORTx_PCRn[SRE]=0), and
• are configured for high drive strength (PORTx_PCRn[DSE]=1)
• have their passive filter disabled (PORTx_PCRn[PFE]=0)
R
R
R
R
R
R
Ψ
Symbol
θJA
θJA
θJMA
θJMA
θJB
θJC
JT
Die junction temperature
Ambient temperature
Description
L
=30pF loads,
Thermal resistance, junction to ambient (natural
convection)
Thermal resistance, junction to ambient (natural
convection)
Thermal resistance, junction to ambient (200 ft./
min. air speed)
Thermal resistance, junction to ambient (200 ft./
min. air speed)
Thermal resistance, junction to board
Thermal resistance, junction to case
Thermal characterization parameter, junction to
package top outside center (natural convection)
Description
K20 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
Table 9. Thermal operating requirements
Preliminary
Peripheral operating requirements and behaviors
TBD
TBD
TBD
TBD
TBD
TBD
TBD
MAPBGA
81
Min.
–40
–40
TBD
TBD
TBD
TBD
TBD
TBD
TBD
80 LQFP Unit
Max.
125
105
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
1
1
1
1
2
3
4
Notes
Unit
°C
°C
19