IGCM10F60GA Infineon Technologies, IGCM10F60GA Datasheet - Page 4
IGCM10F60GA
Manufacturer Part Number
IGCM10F60GA
Description
IGBT Modules MINI DUAL-IN-LINE 10A/600V W/NTC 24PIN
Manufacturer
Infineon Technologies
Datasheet
1.IGCM10F60GA.pdf
(14 pages)
Specifications of IGCM10F60GA
Configuration
Dual Modules
Collector- Emitter Voltage Vceo Max
600 V
Continuous Collector Current At 25 C
10 A
Power Dissipation
1.2 KW
Mounting Style
Through Hole
Package / Case
PG-MDIP-24-1
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
IGCM10F60GA
Manufacturer:
WS
Quantity:
1 000
Part Number:
IGCM10F60GA
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
CIPOS™ IGCM10F60GA
CIPOS™
Control Integrated POwer System
Dual In-Line Intelligent Power Module
3Φ-bridge 600V / 10A
Features
Fully isolated Dual In-Line molded module
Infineon
Rugged SOI gate driver technology with
Allowable negative VS potential up to -11V for
Integrated bootstrap functionality
Over current shutdown
Temperature monitor
Under-voltage lockout at all channels
Low side emitter pins accessible for all phase
Cross-conduction prevention
All of 6 switches turn off during protection
Minimum deadtime built in driver IC
Lead-free terminal plating; RoHS compliant
Target Applications
Dish washers
Refrigerators
Washing machines
Air-conditioners
Fans
Low power motor drives
Data Sheet
monolithic body diode
stability against transient and negative voltage
signal transmission at VBS=15V
current monitoring (open emitter)
reverse
conducting
IGBTs
with
4/14
Description
integrating various power and control components
to increase reliability, optimize PCB size and
system costs.
It is designed to control three phase AC motors
and permanent magnet motors in variable speed
drives for applications like air conditioning,
refrigerator and washing machine. The package
concept is specially adapted to power applications,
which
electrical isolation, but also EMI-save control and
overload protection. The features of Infineon
reverse conducting IGBT are combined with an
optimized SOI gate driver for excellent electrical
performance.
System Configuration
3 half bridges with reverse conducting IGBT
3Φ SOI gate driver
Thermistor
Pin-to-heasink creepage distance typ. 1.6mm
The CIPOS™ module family offers the chance for
need
good
thermal
conduction
Aug. 2010
and