A54SX72A-PQG208 Actel, A54SX72A-PQG208 Datasheet - Page 31
A54SX72A-PQG208
Manufacturer Part Number
A54SX72A-PQG208
Description
FPGA - Field Programmable Gate Array 108K System Gates
Manufacturer
Actel
Datasheet
1.A54SX08A-TQG100.pdf
(108 pages)
Specifications of A54SX72A-PQG208
Processor Series
A54SX72A
Core
IP Core
Number Of Macrocells
4024
Maximum Operating Frequency
350 MHz
Number Of Programmable I/os
360
Delay Time
4 ns to 8.4 ns
Supply Voltage (max)
5.25 V
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Development Tools By Supplier
Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA
Mounting Style
SMD/SMT
Supply Voltage (min)
2.25 V
Number Of Gates
72 K
Package / Case
PQFP-208
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
A54SX72A-PQG208
Manufacturer:
ACTEL
Quantity:
1 400
Company:
Part Number:
A54SX72A-PQG208
Manufacturer:
Microsemi SoC
Quantity:
10 000
Company:
Part Number:
A54SX72A-PQG208A
Manufacturer:
Microsemi SoC
Quantity:
10 000
Company:
Part Number:
A54SX72A-PQG208I
Manufacturer:
Microsemi SoC
Quantity:
10 000
Part Number:
A54SX72A-PQG208I
Manufacturer:
ACTEL/爱特
Quantity:
20 000
Thermal Characteristics
Introduction
The temperature variable in Actel Designer software refers to the junction temperature, not the ambient, case, or
board temperatures. This is an important distinction because dynamic and static power consumption will cause the
chip's junction to be higher than the ambient, case, or board temperatures.
between thermal resistance, temperature gradient and power.
Where:
Table 2-12 • Package Thermal Characteristics
Package Type
Thin Quad Flat Pack (TQFP)
Thin Quad Flat Pack (TQFP)
Thin Quad Flat Pack (TQFP)
Plastic Quad Flat Pack (PQFP)
Plastic Quad Flat Pack (PQFP) with Heat Spreader
Plastic Ball Grid Array (PBGA)
Fine Pitch Ball Grid Array (FBGA)
Fine Pitch Ball Grid Array (FBGA)
Fine Pitch Ball Grid Array (FBGA)
Notes:
1. The A54SX08A PQ208 has no heat spreader.
2. The SX-A PQ208 package has a heat spreader for A54SX16A, A54SX32A, and A54SX72A.
θ
θ
T
T
T
P
J
A
C
JA
JC
=
=
= Junction temperature
= Ambient temperature
= Ambient temperature
= total power dissipated by the device
Junction-to-air thermal resistance
Junction-to-case thermal resistance
1
2
Count
Pin
100
144
176
208
208
329
144
256
484
θ
θ
JA
JA
=
=
v5.3
T
----------------- -
T
----------------
C
J
–
P
–
P
θ
3.8
3.8
3.8
3.2
14
11
11
8
3
JC
T
T
A
A
Still Air
33.5
33.5
24.7
26.1
16.2
17.1
26.9
26.6
18
EQ 2-9
200 ft./min.
1.0 m/s
and
27.4
19.9
22.5
13.3
13.8
22.9
22.8
14.7
28
θ
JA
EQ 2-10
500 ft./min.
2.5 m/s
give the relationship
25.7
20.8
11.9
12.8
21.5
21.5
13.6
25
18
SX-A Family FPGAs
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
EQ 2-10
EQ 2-9
2-11