MMA7455LT Freescale Semiconductor, MMA7455LT Datasheet - Page 31

Board Mount Accelerometers 3-AXIS DIGITAL 2 4 8G

MMA7455LT

Manufacturer Part Number
MMA7455LT
Description
Board Mount Accelerometers 3-AXIS DIGITAL 2 4 8G
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MMA7455LT

Sensing Axis
X, Y, Z
Acceleration
2 g, 4 g, 8 g
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.4 V
Supply Current
400 uA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Sensitivity
64 LSB/g
Package / Case
LGA-14
Output Type
Digital
Acceleration Range
± 2g, ± 4g, ± 8g
No. Of Axes
3
Sensor Case Style
LGA
No. Of Pins
14
Supply Voltage Range
2.4V To 3.6V
Operating Temperature Range
-40°C To +85°C
Filter Terminals
SMD
Rohs Compliant
Yes
Ic Interface Type
I2C, SPI
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MMA7455LT
Manufacturer:
FREESCALE
Quantity:
18 300
Part Number:
MMA7455LT
Manufacturer:
FREESCALE
Quantity:
20 000
Part Number:
MMA7455LT
Quantity:
10
6.
7.
8.
9.
10. Do not use a screw down or stacking to fix the PCB into an enclosure because this could bend the PCB putting stress on
11. The PCB should be rated for the multiple lead-free reflow condition with max 260°C temperature.
Please cross reference with the device data sheet for mounting guidelines specific to the exact device used.
Freescale LGA sensors are compliant with Restrictions on Hazardous Substances (RoHS), having halide free molding compound
(green) and lead-free terminations. These terminations are compatible with tin-lead (Sn-Pb) as well as tin-silver-copper
(Sn-Ag-Cu) solder paste soldering processes. Reflow profiles applicable to those processes can be used successfully for solder-
ing the devices.
Sensors
Freescale Semiconductor
Do not place any components or vias at a distance less than 2 mm from the package land area. This may cause additional
package stress if it is too close to the package land area.
Signal traces connected to pads should be as symmetric as possible. Put dummy traces on NC pads in order to have same
length of exposed trace for all pads. Signal traces with 0.1 mm width and min. 0.5 mm length for all PCB land pads near the
package are recommended as shown in
Use a standard pick and place process and equipment. Do not us a hand soldering process.
It is recommended to use a cleanable solder paste with an additional cleaning step after SMT mount.
the package.
10x0.8mm
Figure 22. Stencil Design Guidelines
Figure 21
and
14x0.575mm
Figure
22. Wider trace can be continued after the 0.5 mm zone.
Signal trace near
package
14x0.875mm
Package
footprint
Stencil opening = PCB landing
pad -0.025mm
= 0.575mmx0,875mm
MMA7455L
31

Related parts for MMA7455LT