B57421V2681J62 EPCOS Inc, B57421V2681J62 Datasheet - Page 14
![THERMISTOR NTC 680 OHM 5% 0805](/photos/16/24/162475/ptc__smd__thermistor_sml.jpg)
B57421V2681J62
Manufacturer Part Number
B57421V2681J62
Description
THERMISTOR NTC 680 OHM 5% 0805
Manufacturer
EPCOS Inc
Series
B574**V2r
Type
NTCr
Specifications of B57421V2681J62
Package / Case
0805 (2012 Metric)
Resistance In Ohms @ 25°c
680
Resistance Tolerance
±5%
B Value Tolerance
±3%
B25/50
3940K
B25/85
3980K
B25/100
4000K
Operating Temperature
-55°C ~ 125°C
Power - Max
210mW
Mounting Type
Surface Mount
Description Of Terminals
Leadless
Mounting Style
Surface Mount
Pin Count
2
Resistance @ 25c
680Ohm
Thermal Time Constant
10s
Percentage Of Resistance Tolerance @ 25c
±5
Product Length (mm)
2mm
Product Depth (mm)
1.25mm
Resistance
680 Ohms
Tolerance
5 %
Termination Style
SMD/SMT
Operating Temperature Range
- 55 C to + 125 C
Power Rating
210 MW
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
B0/50
-
B25/75
-
Lead Length
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
B57421V2681J 62
B57421V2681J062
B57421V2681J062
2
An alternative to soldering is the gluing of thermistors with conductive adhesives. The benefit of
this method is that it involves no thermal stress. The adhesives used must be chemically inert.
3
When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused
by thermal expansion during the production process (curing / overmolding process) and during
later operation. The upper category temperature of the thermistor must not be exceeded. Ensure
that the materials used (sealing / potting compound and plastic material) are chemically neutral.
4
If cleaning is necessary, mild cleaning agents such as ethyl alcohol and cleaning gasoline are
recommended. Cleaning agents based on water are not allowed. Ultrasonic cleaning methods are
permissible.
5
In order to maintain their solderability, thermistors must be stored in a non-corrosive atmosphere.
Humidity, temperature and container materials are critical factors.
Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing ma-
terial may be deformed or SMDs may stick together, causing problems during mounting. After
opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as possible.
The components should be left in the original packing. Touching the metallization of unsoldered
thermistors may change their soldering properties.
Storage temperature:
Relative humidity (without condensation):
Solder the thermistors listed in this data book after shipment from EPCOS within the time speci-
fied:
SMDs:
Leaded components:
Please read Cautions and warnings and
Important notes at the end of this document.
Temperature measurement and compensation
SMD NTC thermistors, case size 0805 (2012)
Conductive adhesion
Sealing and potting
Cleaning
Storage
12 months
24 months
Page 14 of 20
<95%, maximum 30 days per annum
75% annual mean
25 C up to 45 C
B574**V2