S-303-CCT Cinch Connectors, S-303-CCT Datasheet - Page 4
S-303-CCT
Manufacturer Part Number
S-303-CCT
Description
CONN SOCKET 3POS JONES SOLDER
Manufacturer
Cinch Connectors
Series
300r
Specifications of S-303-CCT
Connector Type
Receptacle, Jones
Contact Type
Female Socket
Number Of Positions
3
Pitch
0.156" (3.96mm)
Number Of Rows
1
Mounting Type
Free Hanging (In-Line)
Cable Termination
Solder Eyelet
Wire Type
Discrete
Features
Cable Clamp
Contact Finish
Cadmium
Color
Black
Contact Termination
Solder
No. Of Contacts
3
No. Of Rows
1
Connector Mounting
Cable
Gender
Receptacle
Contact Material
Phosphor Bronze
Contact Plating
Cadmium
Rohs Compliant
No
Housing Material
Thermoplastic
Number Of Positions / Contacts
3
Voltage Rating
250 V
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Contact Finish Thickness
-
Row Spacing
-
Fastening Type
-
Lead Free Status / Rohs Status
No
Other names
CJ103S
S-303-CCT-P
S303CCT-P
S-303-CCT-P
S303CCT-P
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The unique construction of the CIN::APSE contact
provides superior mechanical and electrical performance.
It is constructed of randomly wound molybdenum wire that
is formed into a cyclindrical shape. Standard CIN::APSE
contact diameters are 0.020" and 0.040".
Mechanical
• Small form factor (0.020" diameter by 0.32" min. high)
• Low compression force (approx. 2.5 oz. min. per contact)
• Multiple beam structures
• Several points of contact per button
• Extremely lightweight
• Natural wiping action
Electrical
• Short signal path
• Very low inductance and resistance
• Signal integrity tested in the GHz range
The basic button contact
configuration consists of a single
button installed in our patented
“hourglass” design.
The hourglass cavity retains the
CIN::APSE contact securely.
Typically 0.003" protrudes from the
top and the bottom of the insulator.
CIN::APSE
High-Speed Interconnect Technology
THE BUTTON CONTACT
CIN::APSE APPLIED
®
Step 1:
Using alignment features,
position the CIN::APSE
connector between a LGA chip
package and PCB or two PCBs
that have matching footprints.
1-2
Typical CIN::APSE Applications
• LGA package I/O to PC board (IC packages,
• PC board to PC board (parallel processors,
• Flex circuit to PC board (rigid flex, harnessing)
• Flex circuit to ceramic (chip to harness)
multi-chip modules)
enhancement/mezzanine cards)
Step 2:
Add Z-Axis compression
and secure.
Call Toll Free: 1 (800) 323-9612
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