DEMA-9S Cinch Connectors, DEMA-9S Datasheet - Page 4
DEMA-9S
Manufacturer Part Number
DEMA-9S
Description
D SUB CONNECTOR, STANDARD, 9POS, RCPT
Manufacturer
Cinch Connectors
Datasheet
1.4-40-THMB-1.pdf
(282 pages)
Specifications of DEMA-9S
No. Of Contacts
9
D Sub Shell Size
DE
Connector Body Material
Metal
Gender
Receptacle
Contact Termination
Crimp
No. Of Mating Cycles
500
Body Material
Metal
Connector Type
D Sub
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DEMA-9S
Manufacturer:
ITT Cannon, LLC
Quantity:
41
Company:
Part Number:
DEMA-9S-C-NM
Manufacturer:
JAE Electronics
Quantity:
457
Company:
Part Number:
DEMA-9S-C-NM-2
Manufacturer:
JAE Electronics
Quantity:
457
Company:
Part Number:
DEMA-9S-C-NM-2-F0
Manufacturer:
JAE Electronics
Quantity:
457
Company:
Part Number:
DEMA-9S-C-NM-F0
Manufacturer:
JAE Electronics
Quantity:
457
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- Download datasheet (6Mb)
The unique construction of the CIN::APSE contact
provides superior mechanical and electrical performance.
It is constructed of randomly wound molybdenum wire that
is formed into a cyclindrical shape. Standard CIN::APSE
contact diameters are 0.020" and 0.040".
Mechanical
• Small form factor (0.020" diameter by 0.32" min. high)
• Low compression force (approx. 2.5 oz. min. per contact)
• Multiple beam structures
• Several points of contact per button
• Extremely lightweight
• Natural wiping action
Electrical
• Short signal path
• Very low inductance and resistance
• Signal integrity tested in the GHz range
The basic button contact
configuration consists of a single
button installed in our patented
“hourglass” design.
The hourglass cavity retains the
CIN::APSE contact securely.
Typically 0.003" protrudes from the
top and the bottom of the insulator.
CIN::APSE
High-Speed Interconnect Technology
THE BUTTON CONTACT
CIN::APSE APPLIED
®
Step 1:
Using alignment features,
position the CIN::APSE
connector between a LGA chip
package and PCB or two PCBs
that have matching footprints.
1-2
Typical CIN::APSE Applications
• LGA package I/O to PC board (IC packages,
• PC board to PC board (parallel processors,
• Flex circuit to PC board (rigid flex, harnessing)
• Flex circuit to ceramic (chip to harness)
multi-chip modules)
enhancement/mezzanine cards)
Step 2:
Add Z-Axis compression
and secure.
Call Toll Free: 1 (800) 323-9612
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