EMIF02-MIC03F2 STMicroelectronics, EMIF02-MIC03F2 Datasheet - Page 5
EMIF02-MIC03F2
Manufacturer Part Number
EMIF02-MIC03F2
Description
Manufacturer
STMicroelectronics
Datasheet
1.EMIF02-MIC03F2.pdf
(6 pages)
Specifications of EMIF02-MIC03F2
Mounting Style
Surface Mount
Termination
Flat Style
Operating Temp Range
-40C to 85C
Product Height (mm)
0.65mm
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
EMIF02-MIC03F2
Manufacturer:
ST
Quantity:
54 000
Company:
Part Number:
EMIF02-MIC03F2
Manufacturer:
SEOUL
Quantity:
136
PACKAGE MECHANICAL DATA
FLIP CHIP
FOOT PRINT RECOMMENDATIONS
MARKING
®
340µm min for 300µm copper pad diameter
Solder mask opening recommendation :
250µm recommended , 300µm max
500µm ± 10
250µm ± 10
Solder stencil opening : 330µm
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year ww = week)
Copper pad Diameter :
1.07mm ± 50µm
315µm ± 50
x
y
w
x
w
E
z
650µm ± 50
EMIF02-MIC03F2
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