AG503-86PCB TriQuint, AG503-86PCB Datasheet - Page 5

• Manufacturer Part Number: AG503-86PCB
• Description: RF Modules & Development Tools 700-2400MHz Eval Brd 16dBm 21dB Gain
• Manufacturer: TriQuint

Specifications of AG503-86PCB

• Minimum Frequency: 700 MHz
• Minimum Operating Temperature: - 40 C
• Supply Voltage (min): 5 V
• Product: RF Modules
• Maximum Frequency: 2.4 GHz
• Supply Voltage (max): 5.8 V
• Supply Current: 45 mA
• Maximum Operating Temperature: + 85 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1067190

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: [phone] • e-mail: [e-mail] • Web site: www.wj.com, www.TriQuint.com
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded
AG503-86G (Green / Lead-free Sot-86 Package) Mechanical Information
(maximum 245 °C reflow temperature) soldering processes. The plating material on the pins is annealed matte tin over copper.
AG503-86
InGaP HBT Gain Block
Outline Drawing
Land Pattern
Specifications and information are subject to change without notice
The component will be marked with an “S”
designator followed by a two-digit numeric lot
code on the top surface of the package. The
obsolete tin-lead package is marked with an
“H” designator followed by a two-digit
numeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD Rating:
Value:
Test:
Standard:
ESD Rating:
Value:
Test:
Standard:
MSL Rating: Level 3 at +260 °C convection reflow
Standard:
1. Ground / thermal vias are critical for the proper
2. Add as much copper as possible to inner and outer layers
3. Mounting screws can be added near the part to fasten the
4. Do not put solder mask on the backside of the PC board in
5. RF trace width depends upon the PC board material and
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
Mounting Config. Notes
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated thru
diameter of .25 mm (.010”).
near the part to ensure optimal thermal performance.
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
the region where the board contacts the heatsink.
construction.
degrees.
Product Marking
MSL / ESD Rating
Class 1C
Passes ≥ 1000V min.
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Class IV
Passes ≥ 1000V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
JEDEC Standard J-STD-020
Page 5 of 5 March 2008