AD9516-1BCPZ Analog Devices Inc, AD9516-1BCPZ Datasheet - Page 54
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AD9516-1BCPZ
Manufacturer Part Number
AD9516-1BCPZ
Description
IC,Fourteen Distributed-Output Clock Driver,LLCC,64PIN,PLASTIC
Manufacturer
Analog Devices Inc
Type
Clock Generator, Fanout Distributionr
Datasheet
1.AD9516-1BCPZ-REEL7.pdf
(80 pages)
Specifications of AD9516-1BCPZ
Pll
Yes
Input
Clock
Output
CMOS, LVDS, LVPECL
Number Of Circuits
1
Ratio - Input:output
1:14
Differential - Input:output
Yes/Yes
Frequency - Max
2.65GHz
Divider/multiplier
Yes/No
Voltage - Supply
3.135 V ~ 3.465 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
64-LFCSP
Frequency-max
2.65GHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AD9516-1/PCBZ - BOARD EVALUATION FOR AD9516-1
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AD9516-1BCPZ
Manufacturer:
ADI
Quantity:
591
Part Number:
AD9516-1BCPZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
AD9516-1
THERMAL PERFORMANCE
Table 51. Thermal Parameters for the 64-Lead LFCSP
Symbol
θ
θ
θ
Ψ
θ
Ψ
The AD9516 is specified for a case temperature (T
that T
Use the following equation to determine the junction
temperature on the application PCB:
where:
T
T
top center of the package.
Ψ
PD is the power dissipation of the device (see Table 17).
JA
JMA
JMA
JC
J
CASE
JB
JT
JT
is the junction temperature (°C).
is the value from Table 51.
T
is the case temperature (°C) measured by the user at the
CASE
J
= T
is not exceeded, an airflow source can be used.
CASE
Thermal Characteristic Using a JEDEC JESD51-7 Plus JEDEC JESD51-5 2S2P Test Board
Junction-to-ambient thermal resistance, natural convection per JEDEC JESD51-2 (still air)
Junction-to-ambient thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
Junction-to-ambient thermal resistance, 2.0 m/sec airflow per JEDEC JESD51-6 (moving air)
Junction-to-board characterization parameter, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
and JEDEC JESD51-8
Junction-to-case thermal resistance (die-to-heat sink) per MIL-STD-883, Method 1012.1
Junction-to-top-of-package characterization parameter, natural convection per JEDEC JESD51-2 (still air)
+ (Ψ
JT
× PD)
CASE
). To ensure
Rev. A | Page 54 of 80
Values of θ
design considerations. θ
approximation of T
where T
Values of θ
design considerations when an external heat sink is required.
Values of Ψ
design considerations.
T
J
= T
A
is the ambient temperature (°C).
A
JA
JC
JB
+ (θ
are provided for package comparison and PCB
are provided for package comparison and PCB
are provided for package comparison and PCB
JA
× PD)
J
by the following equation:
JA
can be used for a first-order
Value (°C/W)
22.0
19.2
17.2
11.6
1.3
0.1