AD9777BSVZRL Analog Devices Inc, AD9777BSVZRL Datasheet - Page 9
![IC,D/A CONVERTER,DUAL,16-BIT,CMOS,TQFP,80PIN](/photos/6/64/66419/505-80-tqfp_sml.jpg)
AD9777BSVZRL
Manufacturer Part Number
AD9777BSVZRL
Description
IC,D/A CONVERTER,DUAL,16-BIT,CMOS,TQFP,80PIN
Manufacturer
Analog Devices Inc
Series
TxDAC+®r
Datasheet
1.AD9777BSVZ.pdf
(60 pages)
Specifications of AD9777BSVZRL
Settling Time
11ns
Number Of Bits
16
Data Interface
Parallel
Number Of Converters
2
Voltage Supply Source
Analog and Digital
Power Dissipation (max)
410mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
80-TQFP Exposed Pad, 80-eTQFP, 80-HTQFP, 80-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AD9777-EBZ - BOARD EVALUATION FOR AD9777
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AD9777BSVZRL
Manufacturer:
Analog Devices Inc
Quantity:
10 000
ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter
AVDD, DVDD, CLKVDD
AVDD, DVDD, CLKVDD
AGND, DGND, CLKGND
REFIO, FSADJ1/FSADJ2
I
P1B15 to P1B0, P2B15 to P2B0, RESET
DATACLK/PLL_LOCK
CLK+, CLK−
LPF
SPI_CSB, SPI_CLK, SPI_SDIO, SPI_SDO
Junction Temperature
Storage Temperature
Lead Temperature (10 sec)
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only;
functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum ratings for extended periods may affect device reliability.
THERMAL CHARACTERISTICS
Thermal Resistance
80-lead thin quad flat package, exposed pad [TQFP_EP]
θ
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
OUTA
JA
= 23.5°C/W (With thermal pad soldered to PCB)
, I
OUTB
With Respect To
AGND, DGND, CLKGND
AVDD, DVDD, CLKVDD
AGND, DGND, CLKGND
AGND
AGND
DGND
DGND
CLKGND
CLKGND
DGND
Rev. C | Page 9 of 60
Min
−0.3
−4.0
−0.3
−0.3
−1.0
−0.3
−0.3
−0.3
−0.3
−0.3
−65
Max
+4.0
+4.0
+0.3
AVDD + 0.3
AVDD + 0.3
DVDD + 0.3
DVDD + 0.3
CLKVDD + 0.3
CLKVDD + 0.3
DVDD + 0.3
125
+150
300
AD9777
Unit
V
V
V
V
V
V
V
V
V
V
°C
°C
°C