AD9779ABSVZRL Analog Devices Inc, AD9779ABSVZRL Datasheet - Page 60
![IC,D/A CONVERTER,DUAL,16-BIT,CMOS,TQFP,100PIN](/photos/6/60/66082/sv-100-1_sml.jpg)
AD9779ABSVZRL
Manufacturer Part Number
AD9779ABSVZRL
Description
IC,D/A CONVERTER,DUAL,16-BIT,CMOS,TQFP,100PIN
Manufacturer
Analog Devices Inc
Datasheet
1.AD9776ABSVZ.pdf
(60 pages)
Specifications of AD9779ABSVZRL
Design Resources
Interfacing ADL5370 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0016) Interfacing ADL5371 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0017) Interfacing ADL5372 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0018) Interfacing ADL5373 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0019) Interfacing ADL5374 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0020) Interfacing ADL5375 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0021)
Number Of Bits
16
Data Interface
Serial
Number Of Converters
2
Voltage Supply Source
Analog and Digital
Power Dissipation (max)
300mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
100-TQFP Exposed Pad, 100-eTQFP, 100-HTQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AD9779A-EBZ - BOARD EVALUATION FOR AD9779A
Settling Time
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AD9779ABSVZRL
Manufacturer:
Analog Devices Inc
Quantity:
10 000
AD9776A/AD9778A/AD9779A
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD9776ABSVZ
AD9776ABSVZRL
AD9778ABSVZ
AD9778ABSVZRL
AD9779ABSVZ
AD9779ABSVZRL
AD9776A-EBZ
AD9778A-EBZ
AD9779A-EBZ
1
©2007–2008 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Z = RoHS Compliant Part.
1
1
1
1
1
1
1
1
1
NOTES
1. CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED.
2. THE PACKAGE HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF
THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF
THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT IS RECOMMENDED THAT NO PCB SIGNAL
TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE
SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE
DEVICE WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.
SEATING
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
PLANE
0.75
0.60
0.45
0.20
0.09
MAX
1.20
3.5°
7°
0°
25
Figure 113. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
D06452-0-3/08(A)
1
100
26
0.50 BSC
16.00 BSC SQ
PIN 1
COMPLIANT TO JEDEC STANDARDS MS-026-AED-HD
(PINS DOWN)
Package Description
100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
Evaluation Board
Evaluation Board
Evaluation Board
TOP VIEW
14.00 BSC SQ
Dimensions shown in millimeters
0.27
0.22
0.17
Rev. A | Page 60 of 60
(SV-100-1)
0.15
0.05
50
76
75
51
1.05
1.00
0.95
COPLANARITY
0.08
75
51
50
76
BOTTOM VIEW
CONDUCTIVE
HEAT SINK
(PINS UP)
NOM
6.50
100
26
1
25
Package Option
SV-100-1
SV-100-1
SV-100-1
SV-100-1
SV-100-1
SV-100-1