ADSP-21266SKSTZ-2D Analog Devices Inc, ADSP-21266SKSTZ-2D Datasheet - Page 38

• Manufacturer Part Number: ADSP-21266SKSTZ-2D
• Description: IC,DSP,32-BIT,CMOS,QFP,144PIN,PLASTIC
• Manufacturer: Analog Devices Inc
• Series: SHARC®r
• Type: Fixed/Floating Pointr

Specifications of ADSP-21266SKSTZ-2D

• Interface: DAI, SPI
• Clock Rate: 200MHz
• Non-volatile Memory: ROM (512 kB)
• On-chip Ram: 256kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Device Core Size: 32b
• Architecture: Super Harvard
• Format: Floating Point
• Clock Freq (max): 200MHz
• Mips: 200
• Device Input Clock Speed: 200MHz
• Ram Size: 256KB
• Program Memory Size: 512KB
• Operating Supply Voltage (typ): 1.2/3.3V
• Operating Supply Voltage (min): 1.14/3.13V
• Operating Supply Voltage (max): 1.26/3.47V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADSP-21266
ENVIRONMENTAL CONDITIONS
The ADSP-21266 processor is rated for performance under
T
ditions on Page
THERMAL CHARACTERISTICS
Table 35
JEDEC standards JESD51-2 and JESD51-6 and the junction-to-
board measurement complies with JESD51-8. The junction-to-
case measurement complies with MIL-STD-883. All measure-
ments use a 2S2P JEDEC test board.
To determine the junction temperature of the device while on
the application PCB, use
where:
T
T
package
Ψ
the typical value from
moving air).
P
Values of θ
design considerations (θJMA indicates moving air). θ
used for a first order approximation of T
D
AMB
J
CASE
JT
= junction temperature (
= power dissipation (see EE Note No. 216)
= junction-to-top (of package) characterization parameter is
environmental conditions specified in the
= case temperature (
Figure 34. Typical Output Delay or Hold vs. Load Capacitance
10
–2
–4
8
6
4
2
0
and
0
JA
are provided for package comparison and PCB
Table 36
Y = 0.0488X – 1.5923
15.
T
J
T
(at Ambient Temperature)
=
50
J
Table 35
airflow measurements comply with
=
T
CASE
×
T
C) measured at the top center of the
×
LOAD CAPACITANCE (pF)
A
C)
+
and
+
(
θ
100
(
JA
Ψ
Table 36
JT
×
P
×
J
D
P
by the equation
)
D
)
(YJMT indicates
150
Operating Con-
Rev. C | Page 38 of 44 | October 2007
JA
can be
200
where:
T
Values of θ
design considerations when an external heat sink is required.
Table 35. Thermal Characteristics for 136-Ball BGA
Table 36. Thermal Characteristics for 144-Lead LQFP
Parameter
θ
θ
θ
θ
Ψ
Ψ
Ψ
Parameter
θ
θ
θ
θ
Ψ
Ψ
Ψ
A
JA
JMA
JMA
JC
JA
JMA
JMA
JC
JT
JMT
JMT
JT
JMT
JMT
= ambient temperature
JC
are provided for package comparison and PCB
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
×
C
Typical
31.0
27.3
26.0
6.99
0.16
0.30
0.35
Typical
32.5
28.9
27.8
7.8
0.5
0.8
1.0
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W