ADSP-21266SKSTZ-2D Analog Devices Inc, ADSP-21266SKSTZ-2D Datasheet - Page 44

• Manufacturer Part Number: ADSP-21266SKSTZ-2D
• Description: IC,DSP,32-BIT,CMOS,QFP,144PIN,PLASTIC
• Manufacturer: Analog Devices Inc
• Series: SHARC®r
• Type: Fixed/Floating Pointr

Specifications of ADSP-21266SKSTZ-2D

• Interface: DAI, SPI
• Clock Rate: 200MHz
• Non-volatile Memory: ROM (512 kB)
• On-chip Ram: 256kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Device Core Size: 32b
• Architecture: Super Harvard
• Format: Floating Point
• Clock Freq (max): 200MHz
• Mips: 200
• Device Input Clock Speed: 200MHz
• Ram Size: 256KB
• Program Memory Size: 512KB
• Operating Supply Voltage (typ): 1.2/3.3V
• Operating Supply Voltage (min): 1.14/3.13V
• Operating Supply Voltage (max): 1.26/3.47V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADSP-21266
SURFACE-MOUNT DESIGN
Table 39
for Surface-Mount Design and Land Pattern Standard.
Table 39. BGA_ED Data for Use with Surface-Mount Design
ORDERING GUIDE
Analog Devices offers a wide variety of audio algorithms and combinations to run on the ADSP-21266 DSP. For a complete list, visit our
website at www.analog.com/SHARC.
1
2
3
4
©2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Package
136-Lead CSP_BGA (BC-136)
Model
ADSP-21266SKSTZ-1B
ADSP-21266SKSTZ-2B
ADSP-21266SKBCZ-2B
ADSP-21266SKSTZ-1C
ADSP-21266SKSTZ-2C
ADSP-21266SKBCZ-2C
ADSP-21266SKSTZ-1D
ADSP-21266SKSTZ-2D
ADSP-21266SKBCZ-2D
Z = RoHS Compliant Part.
B at end of part number indicates Rev. 0.1 silicon. See
C and D at end of part number indicate Rev. 0.2 silicon. See
Referenced temperature is ambient temperature.
1, 2, 3
is provided as an aide to PCB design. For industry-standard design recommendations, refer to IPC-7351, Generic Requirements
Temperature
Range
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
4
Ball Attach Type
Solder Mask Defined (SMD)
D03758-0-10/07(C)
Table 2 on Page 6
Instruction
Rate
150 MHz
200 MHz
200 MHz
150 MHz
200 MHz
200 MHz
150 MHz
200 MHz
200 MHz
Table 2 on Page 6
Rev. C | Page 44 of 44 | October 2007
for multichannel surround-sound decoder algorithms in on-chip B ROM.
On-Chip
SRAM
2M bit
2M bit
2M bit
2M bit
2M bit
2M bit
2M bit
2M bit
2M bit
for multichannel surround-sound decoder algorithms in on-chip C and D ROM.
ROM
4M bit
4M bit
4M bit
4M bit
4M bit
4M bit
4M bit
4M bit
4M bit
Solder Mask Opening
0.4 mm
Operating
Voltage
1.2 INT/3.3 EXT V 144-Lead LQFP
1.2 INT/3.3 EXT V 144-Lead LQFP
1.2 INT/3.3 EXT V 136-Ball CSP_BGA
1.2 INT/3.3 EXT V 144-Lead LQFP
1.2 INT/3.3 EXT V 144-Lead LQFP
1.2 INT/3.3 EXT V 136-Ball CSP_BGA
1.2 INT/3.3 EXT V 144-Lead LQFP
1.2 INT/3.3 EXT V 144-Lead LQFP
1.2 INT/3.3 EXT V 136-Ball CSP_BGA
Package
Description
Ball Pad Size
0.53 mm
Package
Option
ST-144
ST-144
BC-136
ST-144
ST-144
BC-136
ST-144
ST-144
BC-136