BAS16DXV6T1G ON Semiconductor, BAS16DXV6T1G Datasheet - Page 5
![DIODE SWITCH DUAL 75V SOT563](/photos/5/30/53073/sot-563-6_463a_sml.jpg)
BAS16DXV6T1G
Manufacturer Part Number
BAS16DXV6T1G
Description
DIODE SWITCH DUAL 75V SOT563
Manufacturer
ON Semiconductor
Datasheet
1.BAS16DXV6T1G.pdf
(6 pages)
Specifications of BAS16DXV6T1G
Voltage - Forward (vf) (max) @ If
1.25V @ 150mA
Current - Reverse Leakage @ Vr
1µA @ 75V
Current - Average Rectified (io) (per Diode)
200mA (DC)
Voltage - Dc Reverse (vr) (max)
75V
Reverse Recovery Time (trr)
6ns
Diode Type
Standard
Speed
Small Signal =< 200mA (Io), Any Speed
Diode Configuration
2 Independent
Mounting Type
Surface Mount
Package / Case
SOT-563, SOT-6
Product
Switching Diodes
Peak Reverse Voltage
75 V
Forward Continuous Current
0.2 A
Max Surge Current
0.5 A
Configuration
Dual Parallel
Recovery Time
6 ns
Forward Voltage Drop
1.25 V
Maximum Reverse Leakage Current
1 uA
Operating Temperature Range
- 55 C to + 150 C
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 55 C
Mounting Style
SMD/SMT
Forward Voltage Vf Max
1V
Reverse Recovery Time Trr Max
6ns
Forward Surge Current Ifsm Max
500mA
Diode Case Style
SOT-563
No. Of Pins
2
Leaded Process Compatible
Yes
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
BAS16DXV6T1GOSTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BAS16DXV6T1G
Manufacturer:
ON Semiconductor
Quantity:
34 442
Company:
Part Number:
BAS16DXV6T1G
Manufacturer:
ON Semiconductor
Quantity:
900
Company:
Part Number:
BAS16DXV6T1G
Manufacturer:
ON
Quantity:
30 000
Part Number:
BAS16DXV6T1G
Manufacturer:
ON/安森美
Quantity:
20 000
6
1
e
−X−
D
2
5
4
3
b
0.08 (0.003)
−Y−
6 5 PL
E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
M
BAS16DXV6T1, BAS16DXV6T5
X
0.0531
Y
1.35
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
A
http://onsemi.com
SOT−563, 6 LEAD
CASE 463A−01
0.0197
0.0118
H
0.5
ISSUE F
C
L
E
0.3
0.0394
1.0
5
0.0197
0.5
SCALE 20:1
0.0177
0.45
inches
mm
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
STYLE 10:
DIM
H
PIN 1. CATHODE 1
A
C
D
b
E
e
L
E
2. N/C
3. CATHODE 2
4. ANODE 2
5. N/C
6. ANODE 1
0.50
0.17
0.08
1.50
1.10
0.10
1.50
MIN
MILLIMETERS
0.5 BSC
NOM
0.55
0.22
0.12
1.60
1.20
0.20
1.60
MAX
0.60
0.27
0.18
1.70
1.30
0.30
1.70
0.020
0.007
0.003
0.059
0.043
0.004
0.059
MIN
0.02 BSC
INCHES
0.021
0.009
0.005
0.062
0.047
0.008
0.062
NOM
0.023
0.011
0.007
0.066
0.051
0.012
0.066
MAX