MBRM120ET3G ON Semiconductor, MBRM120ET3G Datasheet

DIODE SCHOTTKY 20V 1A POWERMITE

MBRM120ET3G

Manufacturer Part Number
MBRM120ET3G
Description
DIODE SCHOTTKY 20V 1A POWERMITE
Manufacturer
ON Semiconductor
Datasheet

Specifications of MBRM120ET3G

Voltage - Forward (vf) (max) @ If
530mV @ 1A
Voltage - Dc Reverse (vr) (max)
20V
Current - Average Rectified (io)
1A
Current - Reverse Leakage @ Vr
10µA @ 20V
Diode Type
Schottky
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type
Surface Mount
Package / Case
Powermite®
Product
Schottky Diodes
Peak Reverse Voltage
20 V
Forward Continuous Current
1 A
Max Surge Current
50 A
Configuration
Single
Forward Voltage Drop
0.595 V @ 2 A
Maximum Reverse Leakage Current
10 uA
Operating Temperature Range
- 65 C to + 150 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Capacitance @ Vr, F
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
MBRM120ET3GOSTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MBRM120ET3G
Manufacturer:
ON/安森美
Quantity:
20 000
Part Number:
MBRM120ET3G
Manufacturer:
ON
Quantity:
15 522
MBRM120E
Surface Mount
Schottky Power Rectifier
POWERMITE
Power Surface Mount Package
with a barrier metal and epitaxial construction that produces optimal
forward voltage drop−reverse current tradeoff. The advanced
packaging techniques provide for a highly efficient micro miniature,
space saving surface mount Rectifier. With its unique heatsink design,
the Powermite has the same thermal performance as the SMA while
being 50% smaller in footprint area, and delivering one of the lowest
height profiles, < 1.1 mm in the industry. Because of its small size, it is
ideal for use in portable and battery powered products such as cellular
and cordless phones, chargers, notebook computers, printers, PDAs
and PCMCIA cards. Typical applications are AC−DC and DC−DC
converters, reverse battery protection, and “Oring” of multiple supply
voltages and any other application where performance and size are
critical.
Features
Mechanical Characteristics
© Semiconductor Components Industries, LLC, 2006
September, 2006 − Rev. 2
The Schottky Powermite employs the Schottky Barrier principle
Exposed Cathode Heat Sink
260°C Maximum for 10 Seconds
Low Profile − Maximum Height of 1.1 mm
Small Footprint − Footprint Area of 8.45 mm2
Low V
Supplied in 12 mm Tape and Reel
Low Thermal Resistance with Direct Thermal Path of Die on
Pb−Free Packages are Available
Powermite is JEDEC Registered as DO−216AA
Case: Molded Epoxy
Epoxy Meets UL 94 V−0 @ 0.125 in
Weight: 16.3 mg (approximately)
Lead and Mounting Surface Temperature for Soldering Purposes
F
Provides Higher Efficiency and Extends Battery Life
®
1
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
1.0 AMPERES, 20 VOLTS
SCHOTTKY BARRIER
ORDERING INFORMATION
CATHODE
BCV
M
G
MARKING DIAGRAM
http://onsemi.com
RECTIFIER
POWERMITE
CASE 457
PLASTIC
BCVG
= Device Code
= Date Code
= Pb−Free Package
Publication Order Number:
M
ANODE
MBRM120E/D

Related parts for MBRM120ET3G

MBRM120ET3G Summary of contents

Page 1

MBRM120E Surface Mount Schottky Power Rectifier ® POWERMITE Power Surface Mount Package The Schottky Powermite employs the Schottky Barrier principle with a barrier metal and epitaxial construction that produces optimal forward voltage drop−reverse current tradeoff. The advanced packaging techniques provide ...

Page 2

... Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2%. ORDERING INFORMATION Device MBRM120ET1 MBRM120ET1G MBRM120ET3 MBRM120ET3G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MBRM120E , T = 130°C) ...

Page 3

T = 150° 100°C J 1.0 0.1 0.2 0 INSTANTANEOUS FORWARD VOLTAGE (VOLTS) F Figure 1. Typical Forward Voltage 100E−3 10E− 150°C 1E−3 J 100E− 100°C J 10E−6 1E−6 T ...

Page 4

V , REVERSE VOLTAGE (VOLTS) R Figure 7. Capacitance * Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any re- verse ...

Page 5

Rtjl(t) = Rtjl*r(t) 0.001 0.00001 0.0001 0.001 Figure 9. Thermal Response Junction to Lead 1.0 50% 20% 0.1 10% 5.0% 0.01 2.0% 1.0% 0.001 0.00001 0.0001 0.001 Figure 10. Thermal Response ...

Page 6

... Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. POWERMITE is a registered trademark of and used under a license from Microsemi Corporation. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein ...

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