BAS45AL,115 NXP Semiconductors, BAS45AL,115 Datasheet

DIODE LOW LEAK 125V 250MA SOD80C

BAS45AL,115

Manufacturer Part Number
BAS45AL,115
Description
DIODE LOW LEAK 125V 250MA SOD80C
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAS45AL,115

Package / Case
LL-34, LLDS, MiniMELF, SOD80C
Mounting Type
Surface Mount
Speed
Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr)
1.5µs
Current - Reverse Leakage @ Vr
1nA @ 125V
Voltage - Forward (vf) (max) @ If
1V @ 100mA
Voltage - Dc Reverse (vr) (max)
125V
Capacitance @ Vr, F
4pF @ 0V, 1MHz
Current - Average Rectified (io)
250mA (DC)
Product
Switching Diodes
Peak Reverse Voltage
125 V
Forward Continuous Current
625 mA
Max Surge Current
4 A
Configuration
Single
Recovery Time
1500 ns
Forward Voltage Drop
80 mV
Maximum Reverse Leakage Current
0.001 uA
Maximum Power Dissipation
400 mW
Operating Temperature Range
+ 175 C
Maximum Diode Capacitance
4 pF
Maximum Operating Temperature
+ 175 C
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
934031250115::BAS45AL T/R::BAS45AL T/R
1. Product profile
2. Pinning information
1.1 General description
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
Epitaxial medium-speed switching diode with a low leakage current, encapsulated in a
small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) package.
Table 1.
[1]
Table 2.
[1]
Symbol
I
V
V
Pin
1
2
F
R
F
BAS45AL
Low-leakage diode
Rev. 5 — 6 August 2010
Continuous reverse voltage: max. 125 V
Repetitive peak forward current: max. 625 mA
Low reverse current: max. 1 nA
Switching time: typ. 1.5 μs
Low leakage current applications
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
The marking band indicates the cathode.
Quick reference data
Pinning
Parameter
forward current
reverse voltage
forward voltage
cathode
anode
Description
Conditions
I
F
= 100 mA
[1]
Simplified outline
k
[1]
Min
-
-
-
a
Typ
-
-
-
Product data sheet
Graphic symbol
1
Max
250
125
1000
006aab040
V
Unit
mA
mV
2

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BAS45AL,115 Summary of contents

Page 1

BAS45AL Low-leakage diode Rev. 5 — 6 August 2010 1. Product profile 1.1 General description Epitaxial medium-speed switching diode with a low leakage current, encapsulated in a small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) package. 1.2 Features and benefits ...

Page 2

... NXP Semiconductors 3. Ordering information Table 3. Type number Package BAS45AL 4. Marking Table 4. Type number BAS45AL 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V RRM FRM I FSM P tot stg [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. ...

Page 3

... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol R th(j-t) R th(j-a) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 7. Characteristics Table 7. ° Symbol [1] When switched from I BAS45AL Product data sheet Thermal characteristics Parameter thermal resistance from junction to tie-point thermal resistance from ...

Page 4

... NXP Semiconductors 300 I F (mA) 200 100 0 0 100 FR4 PCB, standard footprint Fig 1. Forward current as a function of ambient temperature; derating curve Based on square wave currents °C prior to surge T j Fig 3. Non-repetitive peak forward current as a function of pulse duration; maximum values BAS45AL ...

Page 5

... NXP Semiconductors (nA − 125 V R Fig 4. Reverse current as a function of junction temperature 8. Test information D.U. Ω × Fig 6. Reverse recovery time test circuit and waveforms BAS45AL Product data sheet mbd456 max typ 100 150 T (°C) j Fig SAMPLING OSCILLOSCOPE Ω mga881 All information provided in this document is subject to legal disclaimers. ...

Page 6

... NXP Semiconductors 9. Package outline Fig 7. 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package Description BAS45AL [1] For further information and the availability of packing methods, see BAS45AL Product data sheet 0.3 3.7 3 ...

Page 7

... NXP Semiconductors 11. Soldering Fig 8. 2.90 Fig 9. BAS45AL Product data sheet 4.55 4.30 2.30 2.25 1.70 1.60 0.90 (2x) Reflow soldering footprint SOD80C 6.30 4.90 2.70 1.90 1.70 Wave soldering footprint SOD80C All information provided in this document is subject to legal disclaimers. Rev. 5 — 6 August 2010 ...

Page 8

... Release date BAS45AL v.5 20100806 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Table 1 “Quick reference • Section 4 • ...

Page 9

... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...

Page 10

... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...

Page 11

... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 Packing information . . . . . . . . . . . . . . . . . . . . . 6 11 Soldering ...

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