SIDC30D120E6 Infineon Technologies, SIDC30D120E6 Datasheet
SIDC30D120E6
Specifications of SIDC30D120E6
Related parts for SIDC30D120E6
SIDC30D120E6 Summary of contents
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... Die Size F 2 35A 5.5 x 5.5 mm suitable for epoxy and soft solder die bonding electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C SIDC30D120E6 A C Package Ordering Code Q67050-A4125- sawn on foil A001 5.5 x 5.5 30 ...
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... V =600V R I =35A ° di/dt=910A ° =35A di/dt=910A =35A / di/dt=910A =35A di/dt=910A SIDC30D120E6 Value Unit 1200 tbd 70 -55...+150 C Value Unit min. Typ. max. 27 µA 1200 V 1.9 V Value Unit min. Typ. max. tbd ns 36.8 A 46.3 3.55 µ C 7.63 tbd tbd 1 ...
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... CHIP DRAWING: Edited by INFINEON Technologies HV3, L 4182P, Edition 1, 8.01.2002 Preliminary SIDC30D120E6 ...
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... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies HV3, L 4182P, Edition 1, 8.01.2002 Preliminary SIDC30D120E6 INFINEON TECHNOLOGIES / EUPEC tbd ...