NTHD2102PT1G ON Semiconductor, NTHD2102PT1G Datasheet - Page 6
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NTHD2102PT1G
Manufacturer Part Number
NTHD2102PT1G
Description
MOSFET PWR P-CH DUAL 8V CHIPFET
Manufacturer
ON Semiconductor
Datasheet
1.NTHD2102PT1G.pdf
(6 pages)
Specifications of NTHD2102PT1G
Fet Type
2 P-Channel (Dual)
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
58 mOhm @ 3.4A, 4.5V
Drain To Source Voltage (vdss)
8V
Current - Continuous Drain (id) @ 25° C
3.4A
Vgs(th) (max) @ Id
1.5V @ 250µA
Gate Charge (qg) @ Vgs
16nC @ 2.5V
Input Capacitance (ciss) @ Vds
715pF @ 6.4V
Power - Max
1.1W
Mounting Type
Surface Mount
Package / Case
8-ChipFET™
Configuration
Dual Dual Drain
Transistor Polarity
P-Channel
Resistance Drain-source Rds (on)
0.058 Ohm @ 4.5 V
Forward Transconductance Gfs (max / Min)
8 S
Drain-source Breakdown Voltage
8 V
Gate-source Breakdown Voltage
+/- 8 V
Continuous Drain Current
3.4 A
Power Dissipation
1100 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
NTHD2102PT1GOS
NTHD2102PT1GOS
NTHD2102PT1GOSTR
NTHD2102PT1GOS
NTHD2102PT1GOSTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
NTHD2102PT1G
Manufacturer:
ON
Quantity:
36 000
Part Number:
NTHD2102PT1G
Manufacturer:
ON/安森美
Quantity:
20 000
e1
PUBLICATION ORDERING INFORMATION
ChipFET is a trademark of Vishay Siliconix.
LITERATURE FULFILLMENT:
H
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
E
0.457
0.018
8
1
7
2
0.026
D
0.66
e
6
3
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
5
4
Basic
2.032
0.08
0.711
0.028
b
E
A
*For additional information on our Pb−Free strategy and soldering
SCALE 20:1
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
q
c
0.05 (0.002)
0.635
0.025
SOLDERING FOOTPRINT*
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
inches
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
PACKAGE DIMENSIONS
mm
L
http://onsemi.com
CASE 1206A−03
5
4
NTHD2102P
ChipFET]
ISSUE G
6
3
STYLE 2:
6
PIN 1. SOURCE 1
7
2
2. GATE 1
3. SOURCE 2
4. GATE 2
5. DRAIN 2
6. DRAIN 2
7. DRAIN 1
8. DRAIN 1
8
1
0.457
0.018
0.635
0.025
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MOLD GATE BURRS SHALL NOT EXCEED 0.13 MM PER SIDE.
4. LEADFRAME TO MOLDED BODY OFFSET IN HORIZONTAL
5. DIMENSIONS A AND B EXCLUSIVE OF MOLD GATE BURRS.
6. NO MOLD FLASH ALLOWED ON THE TOP AND BOTTOM LEAD
DIM
AND VERTICAL SHALL NOT EXCEED 0.08 MM.
SURFACE.
H
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A
D
q
b
c
E
e
L
E
0.026
0.66
1.00
0.25
0.10
2.95
1.55
0.28
1.80
MIN
MILLIMETERS
0.65 BSC
0.55 BSC
5° NOM
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
NOM
2.032
1.05
0.30
0.15
3.05
1.65
0.35
1.90
0.08
Style 2
0.254
0.010
MAX
1.10
0.35
0.20
3.10
1.70
0.42
2.00
SCALE 20:1
0.039
0.010
0.004
0.061
0.071
0.116
0.011
MIN
NTHD2102P/D
0.025 BSC
0.022 BSC
INCHES
5° NOM
1.092
0.043
0.041
0.012
0.006
0.120
0.065
0.014
0.075
NOM
inches
mm
0.178
0.007
0.043
0.014
0.008
0.122
0.067
0.017
0.079
MAX