2N7002ET1G ON Semiconductor, 2N7002ET1G Datasheet - Page 2

• Manufacturer Part Number: 2N7002ET1G
• Description: MOSFET N-CH 60V 260MA SOT-23
• Manufacturer: ON Semiconductor

Specifications of 2N7002ET1G

• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 2.5 Ohm @ 240mA, 10V
• Drain To Source Voltage (vdss): 60V
• Current - Continuous Drain (id) @ 25° C: 260mA
• Vgs(th) (max) @ Id: 2.5V @ 250µA
• Gate Charge (qg) @ Vgs: 0.81nC @ 5V
• Input Capacitance (ciss) @ Vds: 26.7pF @ 25V
• Power - Max: 300mW
• Mounting Type: Surface Mount
• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Configuration: Single
• Transistor Polarity: N-Channel
• Resistance Drain-source Rds (on): 2.5 Ohm @ 10 V
• Drain-source Breakdown Voltage: 60 V
• Gate-source Breakdown Voltage: +/- 20 V
• Continuous Drain Current: 0.26 A
• Power Dissipation: 300 mW
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 55 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 2N7002ET1G; 2N7002ET1GOSTR

Product Bulletin #16134
3.
Parts with a smooth bottom surface finish have been attributed with higher failure rates as compared to failure rates
of parts with a matte finish. A matte finish has more surface area for the glue to adhere to as compared to a part
with a smooth surface. As a containment action, ON Semiconductor has placed shipment holds on any inventories
of smooth parts and has notified some customers who have received smooth parts.
We also suspended manufacturing on mold systems that produce smooth parts to have those mold systems
enhanced to produce parts with a matte surface finish. These containment actions have temporarily affected our
capacity but have been resolved and we have returned to full capacity.
The enhanced matte surface is designed to overcome any variability of the mold compound and aids in a
containment action until we can eliminate that variability.
What to do next?
If you have consumed product starting from date code 0814 and have not experienced any component placement
issues on your boards, you should not be affected. Product reliability is not a concern as parts either solder
normally or they don’t.
If you have a manufacturing process that consists of gluing these components to the bottom side of a board in a
wave solder process and have experienced components falling off boards with a greater than normal frequency,
please contact your ON Semiconductor Customer Service Representative or Salesperson to facilitate product
replacement or contact a technical representative to further discuss the issue for containment or other actions.
For technical assistance, please contact:
Asia Pacific/Japan:
Stephen Ng
ON Semiconductor Quality
Phone: [phone]
Email:
United States:
Mark Wasilewski
ON Semiconductor Quality
Phone: [phone]
Email:
Europe:
Herve Marchionini
ON Semiconductor Quality,
Phone: [phone]
Email:
Issue Date: 11 Jul 2008
Surface finish of parts
[e-mail]
[e-mail]
[e-mail]
Rev.07-02-06
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