MT46H16M16LFBF-6 IT:H Micron Technology Inc, MT46H16M16LFBF-6 IT:H Datasheet - Page 76
MT46H16M16LFBF-6 IT:H
Manufacturer Part Number
MT46H16M16LFBF-6 IT:H
Description
DRAM Chip DDR SDRAM 256M-Bit 16Mx16 1.8V 60-Pin VFBGA Tray
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Datasheet
1.MT46H16M16LFBF-6_ITH.pdf
(96 pages)
Specifications of MT46H16M16LFBF-6 IT:H
Density
256 Mb
Maximum Clock Rate
166 MHz
Package
60VFBGA
Address Bus Width
15 Bit
Operating Supply Voltage
1.8 V
Maximum Random Access Time
6.5|5 ns
Operating Temperature
-40 to 85 °C
Organization
16Mx16
Address Bus
15b
Access Time (max)
6.5/5ns
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
100mA
Pin Count
60
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Compliant
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Figure 39: WRITE-to-READ – Interrupting
PDF: 09005aef834bf85b
256mb_mobile_ddr_sdram_t36n.pdf - Rev. H 11/09 EN
Command
Address
t
t
t
DQSS (NOM)
DQSS (MIN)
DQSS (MAX)
DQS
DQS
DQS
DQ
DQ
DQ
CK#
DM
DM
DM
CK
4
5
4
5
4
5
WRITE
Bank a,
Col b
T0
Notes:
t
t
t
1,2
DQSS
DQSS
DQSS
1. An interrupted burst of 4 is shown; 2 data elements are written.
2. A10 is LOW with the WRITE command (auto precharge is disabled).
3.
4. DQS is required at T2 and T2n (nominal case) to register DM.
5. D
D
IN
t
NOP
WTR is referenced from the first positive CK edge after the last data-in pair.
D
T1
IN
IN
b = data-in for column b; D
D
D
IN
IN
T1n
D
IN
D
IN
NOP
T2
t
WTR
T2n
3
76
Bank a,
READ
Col n
T3
OUT
256Mb: x16, x32 Mobile LPDDR SDRAM
n = data-out for column n.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
NOP
T4
Don’t Care
CL = 3
CL = 3
CL = 3
T5
NOP
©2008 Micron Technology, Inc. All rights reserved.
WRITE Operation
T5n
Transitioning Data
D
D
D
OUT
OUT
OUT
T6
NOP
D
D
D
OUT
OUT
OUT
T6n
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