BGA 777L7 E6327 Infineon Technologies, BGA 777L7 E6327 Datasheet - Page 17
BGA 777L7 E6327
Manufacturer Part Number
BGA 777L7 E6327
Description
RF Amplifier RF SILICON MMIC
Manufacturer
Infineon Technologies
Type
Low Power Single Bandr
Datasheet
1.BGA_777L7_E6327.pdf
(24 pages)
Specifications of BGA 777L7 E6327
Operating Frequency
2650 MHz
P1db
4 dBm
Noise Figure
1.2 dB
Operating Supply Voltage
2.8 V
Supply Current
10 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
TSLP-7-1
Minimum Operating Temperature
- 30 C
Other names
BGA777L7E6327XT
3
3.1
Figure 2
Note: Package paddle (Pin 0) has to be RF grounded.
Table 10
Part Number
L1 ... L3
C1 ... C3
RREF
Data Sheet
2600 MHz
V
V
EN
GS
= 0 / 2.8 V
= 0 / 2.8 V
RFIN
3.3nH
Application Circuit and Block Diagram
UMTS Band 7 Application Circuit Schematic
Application circuit with chip outline (top view)
Parts List
L1
3.9nH
L2
Part Type
Chip inductor
Chip capacitor
Chip resistor
2.4pF
C1
RFIN
VEN
VGS
1
2
3
Biasing & Logic
Circuitry
Manufacturer
Various
Various
Various
BGA777L7 - Low Power Single-Band UMTS LNA
17
7 GND
BGA777L7_Appl _Band7_BlD.vsd
UMTS Band 7 Application Circuit Schematic
Size
0402
0402
0402
Application Circuit and Block Diagram
RFOUT
RREF
VCC
6
5
4
3.3nH
Comment
Wirewound, Q ≈ 50
L3
10nF
8.2kΩ
R
C3
REF
V3.0, 2009-07-02
V
CC
1.5pF
= 2.8 V
C2
RFOUT
2600 MHz